ABS电子继电器注塑成型优化分析  

Optimization Analysis of ABS Electronic Relay Injection Molding

作　　者：张苏新 ZHANG Su-xin(Suzhou Voctional University,Suzhou 215104,China)

机构地区：[1]苏州市职业大学电子信息工程学院,江苏苏州215104

出　　处：《塑料科技》2024年第8期109-112,共4页Plastics Science and Technology

摘　　要：电子继电器塑料方案设计中,注塑成型后的最大变形量是重点需要控制的参数。针对某丙烯腈-丁二烯-苯乙烯(ABS)电子继电器外壳的注塑成型及变形进行了模拟研究。通过流动阻力及浇口匹配性分析得到最佳的浇口位置并以此建立热流道系统。正交试验分析得到:对于变形量,保压时间的影响为极显著,料筒温度和模腔温度的影响为显著,注射时间的影响为不显著。通过观察最大变形量随工艺水平变化的曲线得到优化的工艺参数组合为A2B3C1D3(模腔温度45℃、料筒温度250℃、保压时间14 s、注射时间0.9 s)。优化工艺的模拟验证发现:最大变形量从0.341 0 mm降低至0.212 8 mm,优化率达到37.6%,且充填状态、外观、注射压力等均符合要求。In the design of plastic solutions for electronic relays,the maximum deformation after injection molding is a key parameter that needs to be controlled.This article conducts a simulation study on the injection molding and deformation of an ABS electronic relay housing.Obtain the optimal gate position through flow resistance and gate matching analysis,and establish a hot runner system based on this.Orthogonal test analysis shows that for deformation,the influence of holding time is extremely significant,the influence of barrel temperature and mold cavity temperature is significant,and the influence of injection time is not significant.The optimized process parameter combination A2B3C1D3(mold cavity temperature 45℃,barrel temperature 250℃,holding time 14 s,and injection time 0.9 s)was obtained by observing the curve of maximum deformation changing with the process level.The simulation verification of the optimized process found that the maximum deformation was reduced from 0.3410 mm to 0.2128 mm,with an optimization rate of 37.6%,and the filling state,appearance,injection pressure all met the requirements.

关 键 词：电子继电器 丙烯腈-丁二烯-苯乙烯 仿真模拟 正交试验 工艺优化 

分 类 号：TQ320.52[化学工程—合成树脂塑料工业] TP391.7[自动化与计算机技术—计算机应用技术]