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作 者:肖永平 马世娟 倪晓东 XIAO Yongping;MA Shijuan;NI Xiaodong(China Keys System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China)
机构地区:[1]中科芯集成电路有限公司,江苏无锡214072
出 处:《电子设计工程》2024年第19期115-118,123,共5页Electronic Design Engineering
摘 要:针对两种版图设计方案中关键信号的电磁干扰大小及其产生的原因进行分析,以达到预识别功能模块是否存在电磁干扰的目的。采用软件进行信号间隔离度仿真,结合功能模块测试试验,在产品设计初期进行相关电磁干扰仿真可减小关键信号被干扰的风险。模块实测结果显示,方案一的输出信号存在干扰,方案二的输出信号不存在干扰。两种方案的仿真结果与实测结果吻合,实测结果验证了隔离度仿真结果的可参考性。The Electromagnetic Interference(EMI)magnitude of key signals in two layout design schemes and its causes are analyzed to achieve the purpose of pre-identifying the existence of Electromagnetic Interference in functional modules.Using software to simulate the degree of isolation between signals,combined with functional module test,relevant Electromagnetic Interference simulation at the initial stage of product design can reduce the risk of key signals being interfered.The measured results of the module show that there is interference in the output signal of scheme 1,and no interference in the output signal of scheme 2.The simulation results of the two schemes are consistent with the measured results,and the measured results verify the referability of the simulation results of isolation degree.
分 类 号:TN959.4[电子电信—信号与信息处理]
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