共聚型聚酰亚胺树脂的成型工艺与性能研究  

Study on Molding Process and Properties of Copolymerized Polyimide Resin

作　　者：刘京妮 崔晶 张培斌 姜天 孙旭阳 LIU Jingni;CUI Jing;ZHANG Peibin;JIANG Tian;SUN Xuyang(SINOPEC Shanghai Research Institute of Petrochemical Technology Company Limited,Shanghai 201208,China)

机构地区：[1]中石化(上海)石油化工研究院有限公司,上海201208

出　　处：《化学反应工程与工艺》2024年第4期314-323,共10页Chemical Reaction Engineering and Technology

摘　　要：为改善热固性聚酰亚胺树脂的加工性,对聚酰亚胺树脂进行共聚改性,制备易于加工、热性能优异的聚酰亚胺树脂,并对其反应机理、固化动力学和成型工艺进行研究。通过红外测试和核磁^(13)C谱图分析树脂在热处理过程中的组成变化,得到该树脂粉末的最佳干燥温度为250℃;建立固化动力学方程,并得到不同温度条件下固化程度随时间的变化趋势,即在340℃保温100 min后固化达到100%。流变测试得到树脂最低熔体黏度为52.1 Pa·s,凝胶点在310℃保温28 min处,给真空排气等工艺保留充足的操作时间,加工窗口较宽。通过综合特性的表征分析,确定了树脂成型工艺,制备的共聚型聚酰亚胺树脂具有较好的加工性和热性能,玻璃化转变温度达到370℃。To improve the processability of thermosetting polyimide resin,a modified polyimide resin with excellent thermal properties was synthesized through copolymerization.The reaction mechanism,curing kinetics,and molding process of the resin were studied.The composition changes of the resin during heat treatment were analyzed by Fourier infrared spectroscopy(FT-IR)and ^(13)C nuclear magnetic resonance(13C-NMR)spectrum,and the optimum drying temperature of the resin powder was determined to be 250℃.The curing kinetics equation was established,and the changing trend of curing degree with time under different temperature conditions was obtained,the curing degree reached 100%after 100 min at 340℃.The processing window was wide,the lowest melt viscosity of the resin was 52.1 Pa∙s,and the gel transformation occurred at 28 min under the temperature of 310℃,allowing sufficient operating time for exhaust processes.The molding process of PI resin was determined based on comprehensive characterization,and the copolymerized polyimide resin obtained exhibited good processability and thermal properties,with a glass transition temperature of 370℃.

关 键 词：聚酰亚胺 树脂 固化 动力学 成型工艺 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]