聚酰亚胺基耐高温胶粘剂的研究进展  

Research progress of polyimide-based high-temperature resistant adhesive

作　　者：凤鹏举 唐富强 李靖辉 王艳军 Feng Pengju;Tang Fuqiang;Li Jinghui;Wang Yanjun(Guangzhou High-Tech Zone Institute for Energy Technology Co.,Ltd.,Guangzhou 510670,Guangdong,China)

机构地区：[1]广州高新区能源技术研究院有限公司,广东广州510670

出　　处：《中国胶粘剂》2024年第9期9-16,共8页China Adhesives

摘　　要：聚酰亚胺胶粘剂具有突出的耐高温性能、尺寸稳定性、物理和化学稳定性、介电性能及粘接性能,是综合性能优异的一类胶粘剂,因而受到了越来越多的关注。本文主要从分子结构的视角综述了经典(热塑性、热固性)聚酰亚胺胶粘剂、分子结构改造(分子主链结构改造、端基结构改造)的聚酰亚胺胶粘剂和共混改性的聚酰亚胺胶粘剂的研究进展,并对聚酰亚胺胶粘剂的未来发展趋势进行了展望。Polyimide adhesive has outstanding high-temperature resistance,dimensional stability,physical and chemical stability,dielectric properties,and bonding properties,making it a type of adhesive with excellent comprehensive performance,and therefore receiving increasing attention.In this paper,the research progress of classic(thermoplastic,thermosetting)polyimide adhesive,polyimide adhesive with molecular structure modification(molecular main chain structure modification,end group structure modification),and blend modified polyimide adhesive from the perspective of molecular structure was mainly reviewed,and the future development trend of polyimide adhesive was prospected.

关 键 词：聚酰亚胺 胶粘剂 分子结构改造 

分 类 号：TQ430.7[化学工程]