功能梯度压电半导体拉-弯梁的屈曲分析  

Buckling Analysis of A Functionally Graded Piezoelectric Semiconductor Extension-Flexure Beam

作　　者：许家豪 韩超凡 张巧云[1] XU Jiahao;HAN Chaofan;ZHANG Qiaoyun(School of Mechanics and Safety Engineering,Zhengzhou University,Zhengzhou 450001,CHN)

机构地区：[1]郑州大学力学与安全工程学院,郑州450001

出　　处：《半导体光电》2024年第4期634-639,共6页Semiconductor Optoelectronics

基　　金：国家自然科学基金项目(11702251);河南省博士后科研基金项目(202003091);河南省高等学校重点科研项目(22A130008)。

摘　　要：基于三维压电半导体理论和一阶剪切变形理论,考虑材料拉伸、弯曲和剪切耦合变形,建立了功能梯度压电半导体拉-弯梁在轴向压力作用下的屈曲模型。借助有限元分析软件COMSOL对压电半导体拉-弯梁进行稳定性分析,得到了功能梯度压电半导体简支梁的前三阶屈曲临界载荷及各机电场的分布规律。通过数值算例,讨论了梁长高比、初始电子浓度和功能梯度参数等对压电半导体拉-弯梁屈曲临界载荷的影响。Based on the three-dimensional piezoelectric-semiconductor(PSC)and first-order shear-deformation theories,and considering the coupling extension,flexure,and shear deformations,a buckling model for a one-dimensional functionally graded PSC extension-flexure beam was established.The stability of a functionally graded PSC extension-flexure beam under an axial load was analyzed via the finite element analysis software COMSOL,and the first three critical buckling loads and distributions of the electromechanical field for a simply supported beam were obtained.The influences of the beam length-height ratio,initial electron concentration,and functionally graded parameters on the critical buckling loads are discussed based on some numerical examples.

关 键 词：压电半导体 功能梯度 拉-弯梁 屈曲 临界载荷 

分 类 号：TN304.9[电子电信—物理电子学]