硅凝胶性能对IGBT模块绝缘可靠性影响研究  

Influence of Silicon Gel Property on Insulation Reliability of IGBT Module

作　　者：肖婉艳 周望君 任亚东 Xiao Wanyan;Zhou Wangjun;Ren Yadong(Zhuzhou CRRC Times Electric Co.,Ltd.,Hu'nan,412001)

机构地区：[1]株洲中车时代半导体有限公司,湖南412001

出　　处：《当代化工研究》2024年第17期65-67,共3页Modern Chemical Research

摘　　要：本文对两种硅凝胶的成分结构、热学性能、物理性能和电学性能进行表征并研究了其高温老化后的退化情况,将两种硅凝胶灌封到高压模块中进行绝缘性能表征和绝缘退化研究。研究结果表明,两种高绝缘强度的硅凝胶粘附性越强、热稳定性越高,其灌封模块的绝缘可靠性越强。In this study,the composition structure,thermal properties,physical properties and electrical properties of two kinds of silicon gel were characterized and their degradation after high-temperature aging was studied.Two kinds of silicon gel were encapsulated into high-voltage modules for insulation performance characterization and insulation degradation research.The research results show that the stronger the adhesion and thermal stability of the two silicon gel with high insulation strength,the stronger the insulation reliability of their encapsulation modules.

关 键 词：硅凝胶 局部放电量 绝缘可靠性 IGBT模块 

分 类 号：TN[电子电信]