面向小卫星的航天电子微系统集成技术  

Aerospace electronic microsystem integration technology for small satellites

作　　者：匡乃亮 刘莹玉 郭雁蓉 赵超 王艳玲[1] KUANG Nailiang;LIU Yingyu;GUO Yanrong;ZHAO Chao;WANG Yanling(Xi'an Microelectronic Technology Institute,Xi'an 710600,China)

机构地区：[1]西安微电子技术研究所,西安710600

出　　处：《先进小卫星技术（中英文）》2024年第2期54-63,共10页Advanced Small Satellite Technology

摘　　要：在卫星小型化、星座巨型化的背景下,为支撑中国航天电子技术的自主可控发展,航天电子微系统集成等技术的应用至关重要,该技术的核心是设计和制造.面向小卫星的微系统模块需要在空间环境适应性的基础上,利用微系统建模与仿真工具实现“芯片封装系统”一体化的协同设计,系统性地优化模块的电源完整性、信号完整性和电磁兼容性.利用硅通孔技术和封装堆叠技术实现模块的三维集成封装.通过对设计和制造两方面核心技术方法的详细介绍,以及典型模块产品的展示,说明了中国在航天电子微系统集成技术领域的积累已具备支持小卫星产品“工业化”发展的能力.In the context of satellite miniaturization and constellation giantization,the application of aerospace electronic microsystem integration technology is crucial for the independent and controllable development of China's aerospace electronic technology.The core of this technology is design and manufacture.For design,the microsystem modules for small satellites required the use of microsystem modeling and simulation tools to achieve collaborative design of the chip-package-system integration on the basis of space environment adaptation.Through the co-design technology,the power integrity,signal integrity,and electromagnetic compatibility of the modules could be systematically optimized.For manufacture,the microsystem modules for small satellites required the use of through-silicon-via technology and package-on-package technology to achieve three-dimensional integrated packaging.A detailed introduction to the two crucial technologies of design and manufacture was elaborated,as well as the typical module products were displayed.This indicates that China's accumulation in the field of aerospace electronic microsystem integration technology has the ability to support the industrialization development of small satellite products.

关 键 词：小卫星 微系统 协同设计 硅通孔 封装堆叠 

分 类 号：TN401[电子电信—微电子学与固体电子学]