单磨粒金刚石微切削碳化硅晶体仿真与实验研究  

Simulation and experimental study on micro-cutting silicon carbide crystal with single grain diamond

作　　者：杨宇飞 李翔 何艳 刘铭 徐子成 高兴军[1] YANG Yufei;LI Xiang;HE Yan;LIU Ming;XU Zicheng;GAO Xingjun(School of Mechanical Engineering,Liaoning Petrochemical University,Fushun 113001,Liaoning,China)

机构地区：[1]辽宁石油化工大学机械工程学院,辽宁抚顺113001

出　　处：《金刚石与磨料磨具工程》2024年第4期495-507,共13页Diamond & Abrasives Engineering

基　　金：辽宁省博士科研启动基金计划项目(2022-BS-292);辽宁省教育厅科学技术研究项目(LJKZ0383);辽宁石油化工大学引进人才科研启动基金(2020XJJL-012);省级大学生创新创业训练计划项目(S202310148031)。

摘　　要：采用有限元软件Abaqus建立金刚石锥形磨粒微切削碳化硅晶体的模型,通过预仿真模型确定切削深度和切削速度的选择范围,分析影响切削力的主、次要因素,研究单一切削参数对碳化硅晶体切削效果的影响;并借助赫兹接触理论,验证加载力对摩擦力、切削边缘形貌、切削深度的影响。结果表明:切削深度是影响切削力的显著因素,预仿真模型确定的切削深度不超过1.50μm;碳化硅晶体切削的最优方案为切削深度取0.50μm、切削速度取76 m/s、磨料切削刃角度取60°。通过控制切削深度可以提高切削稳定性,且在保证切削质量的前提下适当提高切削速度可以提高切削效率。金刚石探针压入晶体的深度与摩擦系数、摩擦力和切削力呈正相关,获得的碳化硅晶体切削边缘的三维轮廓相对平整、光滑。Objectives:The hardness of silicon carbide is second only to those of diamond,cubic boron nitride,and boron carbide,making its processing very difficult.Compared with plastic metal materials,the brittle and hard nature of silicon carbide makes it prone to brittle fracture and edge fragmentation during processing,greatly affecting its superior performance.Therefore,it is crucial to carefully select appropriate cutting methods and establish reasonable cutting pro-cess conditions.Methods:The finite element software Abaqus was used to establish a model of micro-cutting silicon carbide crystal with a diamond conical grain,and the selection range of micro-cutting depth and speed was determined by the pre-simulation model.Then,the main and secondary factors affecting the cutting force were analyzed,and the in-fluence of a single cutting parameter on the cutting effect was studied.In addition,with the help of Hertzian contact stress,the influence of the loading force on the friction force,the morphology of the cutting edge,and the cutting depth was verified by the tip scratching experiment.Results:(1)The cutting depth is a crucial factor that greatly impacts the quality of the cutting process.When the cutting depth is less than 1.50μm,the removal of silicon carbide material primarily occurs through plastic removal.However,when the cutting depth exceeds 1.50μm,cracks of varying lengths and pits of different sizes gradually form at the cutting edge of the workpiece.As the cutting depth increases,the length of cracks and the number of pits also increase.This type of removal is known as brittle removal.To ensure the integrity of the cutting edge and minimize damage to the silicon carbide workpiece,it is essential to control the cutting depth of the abrasive particles during stages I and III,keeping it below 1.50μm.(2)Through variance and range analysis of the main cutting force,the relationship between the three factors and the magnitude of the main cutting force is V>W>U,meaning that cutting depth is the most important f

关 键 词：碳化硅晶体 金刚石磨粒 金刚石探针 切削力 切削边缘质量 

分 类 号：TG74[金属学及工艺—刀具与模具] TG58