电解条件对低密度电解铜粉的形貌影响研究  

Study on the Influence of Electrolytic Conditions on the Morphology of Low Density Electrolytic Copper Powder

作　　者：吴航宇 刘越 张峻嘉 赵艳晶 WU Hangyu;LIU Yue;ZHANG Junjia;ZHAO Yanjing(School of Materials Science and Engineering,Northeastern University,Shenyang 110819,China;Shenyang Remote Friction Sealing Material Co.,Ltd.,Shenyang 110200,China)

机构地区：[1]东北大学材料科学与工程学院,辽宁沈阳110819 [2]沈阳远程摩擦密封材料有限公司,辽宁沈阳110200

出　　处：《金属材料与冶金工程》2024年第5期3-10,共8页Metal Materials and Metallurgy Engineering

基　　金：2022年沈阳市揭榜挂帅"项目(2022-14)。

摘　　要：对电解铜粉的制备工艺进行了研究,探讨了电解过程中硫酸浓度、铜离子浓度、电流密度与添加剂种类对电解铜粉形貌的影响,分析了添加剂在树枝晶电解铜粉制备过程中的影响机理。结果表明:在[H_(2)SO_(4)]浓度0.035mol/L、电流密度500A/m^(2)、[Cu^(2+)]浓度0.1mol/L、添加剂十二烷基苯磺酸钠(SDBS)2g/L的条件下,铜粉有着较发达的树枝晶形貌,总体分布疏松且单个枝晶结构紧密。This paper studies the preparation process of electrolytic copper powder.The effect of sulfuric acid concentration,copper ion concentration,current density and additive on the morphology of electrolytic copper powder was discussed.The mechanism of additive on the preparation of dendrite copper powder was analyzed.The results show that under the conditions of H_(2)SO_(4) concentration 0.035 mol/L,current density 500 A/m^(2),Cu^(2+) concentration 0.1 mol/L and SDBS(2 g/L),the copper powder has a relatively developed dendrite morphology,the overall distribution is loose and the single dendrite structure is compact.

关 键 词：电解铜粉 微观形貌 添加剂 树枝晶 

分 类 号：TF811[冶金工程—有色金属冶金]