微流控芯片非等温热压印微结构成型仿真分析  

Simulation Analysis of Microstructure Molding by Non-isothermal Hot Embossing of Microfluidic Chips

作　　者：易琪 刘耀 占丽娜 刘江英 YI Qi;LIU Yao;ZHAN Lina;LIU Jiangying(School of Mechanical and Electronic Engineering,Pingxiang University,Pingxiang Jiangxi 337000,China)

机构地区：[1]萍乡学院机械电子工程学院,江西萍乡337000

出　　处：《萍乡学院学报》2024年第3期50-53,57,共5页Journal of Pingxiang University

基　　金：江西省教育厅科学技术项目“柱头悬式瓷绝缘子旋压成形机理及仿真研究”(2021B5418);江西省高等学校教学改革研究课题“MOOC环境下的立体化教材建设研究——以《互换性与测量技术》课程为例”(2021B5202)。

摘　　要：传统的热压印方法需要将模具和基片同时加热至一定温度后进行压印成型来生产微流控芯片,存在反复加热冷却、循环时间长、成型效率低的问题。课题组在模具和基片非等温条件下,采用有限元方法研究微流控芯片的非等温热压印成型规律。模拟分析可知:当模具温度高于基片温度时,通过热传递基片能在短时间内与模具温度平衡,延长压印时间可以减少基片应力集中;当模具温度低于基片温度,且都高于玻璃态转化温度时,微结构的压印过程能够达到边压印边冷却的效果,压印周期缩短。通过对微流道压印误差分析可知:在模具温度一定的情况下,微流道深度的相对误差最大;随着模具温度升高,微流道的整体成型质量先升后降,120℃时误差最小。In traditional hot embossing,the microfluidic were imprinted by the mold and substrate which requires to be heated to a certain temperature,the process costs a long cycle time and low efficiency because of heating and cooling repeatedly.In this paper,the finite element method is used to analysis the law of forming when microfluidic chips were imprinted under non-isothermal conditions.According to the simulation analysis,when the mold temperature is higher than the substrate temperature,the substrate can balance with the mold temperature in a short time through heat transfer,and extending the imprinting time can reduce the stress concentration of the substrate.When the mold temperature is lower than the substrate temperature,but both are higher than the glass transition temperature,the microstructure imprinting process can achieve the effect of imprinting and cooling simultaneously,shortening the imprinting cycle.Through the analysis of the microstructure imprinting error,it can be seen that under a fixed mold temperature,the relative error of the microchannel depth is the largest.As the mold temperature increases,the overall molding quality of the microchannel first increases and then decreases,with the smallest error occurring at 120℃.

关 键 词：非等温 热压印 微流控芯片 仿真 

分 类 号：TQ320.66[化学工程—合成树脂塑料工业]