基于谐波分析的封装-电路多物理场耦合仿真方法  

Multi-Physics Coupling Simulation Method of Package-CircuitBased on Harmonic Analysis

作　　者：王卫杰 刘燕婻[1,2] 赵振国 WANG Wei-jie;LIU Yan-nan;ZHAO Zhen-guo(Software Center for High Performance Numerical Simulation,CAEP,Beijing 100088,China;Institute of Applied Physics and Computational Mathematics,Beijing 100088,China)

机构地区：[1]中物院高性能数值模拟软件中心,北京100088 [2]北京应用物理与计算数学研究所,北京100088

出　　处：《电子学报》2024年第8期2718-2725,共8页Acta Electronica Sinica

基　　金：国家自然科学基金(No.12001053)。

摘　　要：场-路耦合仿真可以支持跨越芯片-封装-系统的多层级协同分析,多物理场仿真能够对多物理约束下芯片封装的信号完整性、电源完整性以及可靠性进行提前设计.因此,针对场-路结构的多物理场耦合仿真能够实现在初期对芯片封装的设计方案进行筛选和优化,是先进封装仿真技术最重要的发展方向之一.本文基于场-路耦合仿真和多物理场耦合仿真方法的最新研究进展,提出针对非线性场-路结构的频域仿真方法以及电磁-热耦合计算方法 .该方法能够解决基于时域仿真方法的场-路耦合仿真的长时间迭代问题,实现多物理约束下非线性场-路结构的电磁与热特性快速分析.计算结果验证了本文方法的准确性和高效性.Field-circuit coupling simulation methods can achieve multi-level collaborative analysis across chips,pack⁃ages,and systems.Multi-physics simulation methods can be used to design the signal integrity,power integrity,and reliabil⁃ity of chip packaging under multiple physical constraints.The combination of field-circuit coupling simulation and multiphysics simulation has become a crucial direction for advanced packaging simulation technology.By utilizing these two types of simulations together,early-stage optimization of chip packaging designs can be achieved.This article discusses the current research status of field-circuit coupling simulation and multi-physics coupling simulation.The article also proposes a frequency-domain method for non-linear field-circuit co-simulation and an electromagnetic-thermal coupling simulation method.The frequency-domain method avoids the long iterative process of field-circuit coupling simulation based on timedomain methods,solving the multi-physics electromagnetic-thermal coupling analysis problem of non-linear field-circuit un⁃der multi-physics constraints.The calculation results verify the accuracy and efficiency of the proposed method.

关 键 词：场-路耦合仿真 多物理场耦合仿真 谐波分析方法 

分 类 号：TP319[自动化与计算机技术—计算机软件与理论]