测试工装引起的单板FPGA失效分析及改进方案  

Analysis of Tooling Test-induced Single-board FPGA Failures and Improvement Solutions

作　　者：秦健 徐伟强 高礼 张祥钰 QIN Jian;XU Weiqiang;GAO Li;ZHANG Xiangyu(TBEA Xinjiang New Energy Corporation,Xi′an 710000,China)

机构地区：[1]特变电工新疆新能源股份有限公司,陕西西安710000

出　　处：《电工技术》2024年第14期159-165,176,共8页Electric Engineering

摘　　要：针对某直流输电工程单板出现的FPGA失效故障,以故障FPGA失效表现为出发点,分析单板FPGA失效背景与原因,审视单板测试工装原理及测试方案,并针对问题提出整改措施。This paper entails the descriptions on performance of faulty FPGA,mechanism and causes behind the single-board FPGA failure,principle and scheme of single-board tooling test,and the corresponding countermeasures formulated for the failure,with respect to an FGPA failure encountered by a DC power transmission project.

关 键 词：FPGA失效 电应力 继电器 接触器 工装测试 

分 类 号：TM726.5[电气工程—电力系统及自动化]