基于圆盘结构的管状IC芯片智能取放系统  

Intelligent Pick and Place System of Tubular IC Chip Based on Disc Structure

作　　者：许子康 刘志 吕志华 李双斌 XU Zikang;LIU Zhi;LYU Zhihua;LI Shuangbin(Shandong Huayu University of Technology,Dezhou 253034,China)

机构地区：[1]山东华宇工学院,山东德州253034

出　　处：《现代信息科技》2024年第17期13-18,共6页Modern Information Technology

基　　金：2023年山东省大学生创新创业训练计划平台申报项目(S202313857028)。

摘　　要：随着IC芯片种类的不断增多,芯片管理成为一个日益重要的问题。传统的芯片管理方式往往需要大量的人力和时间,而且容易出现错误,影响生产效率和产品质量。本研究旨在设计一种“芯片管理大师”系统——基于圆盘结构的管状IC芯片智能取放系统,使用温湿度传感器与红外线传感器结合物联网技术实现系统内部环境实时检测,以提高IC芯片取放效率和储存质量。采用系统设计、仿真验证和实验验证方法,展示系统在提高生产效率和质量方面的显著优势。结果显示,该系统具有高度自动化、快速操作和可靠性强的特点。With the increasing types of IC chips,chip management has become an increasingly important issue.Traditional chip management methods often require a lot of manpower and time and are prone to errors,impacting production efficiency and product quality.This research aims to design an“Master of Chip Management”System-intelligent pick and place system of tubular IC chip based on disc structure,utilizing temperature and humidity sensors and infrared sensors,combined with Internet of Things technology to achieve real-time environmental monitoring within the system,to improve the pick and place efficiency and storage quality of IC chip.The system design,simulation verification and experimental verification methods are used to display the significant advantages of the system in improving production efficiency and quality.The results show that the system has the characteristics of high automation,rapid operation and strong reliability.

关 键 词：管状IC芯片 智能取放系统 电子制造 质量优化 

分 类 号：TP311[自动化与计算机技术—计算机软件与理论]