具有电磁屏蔽效能的导热塑料的研究进展  

Research progress on thermal conductive plastics with electromagnetic shielding effectiveness

作　　者：谢卓立 廖文泉 劳志超 韩顺涛 马秀清[1] Xie Zhuoli;Liao Wenquan;Lao Zhichao;Han Shuntao;Ma Xiuqing(Department of Mechanical and Electrical Engineering,Beijing University of Chemical Technology,Beijing 100029,China;China Nuclear Power Engineering Co.LTD.,Beijing 100840,China)

机构地区：[1]北京化工大学机电工程学院,北京100029 [2]中国核电工程有限公司,北京100840

出　　处：《橡塑技术与装备》2024年第10期46-50,共5页China Rubber/Plastics Technology and Equipment

摘　　要：随着芯片的不断发展,具有电磁屏蔽效能的导热塑料备受关注。简述了电磁屏蔽原理及导热原理,综述了MXene系、碳系、金属系填料改性的具有电磁屏蔽效能导热塑料的研究进展。With the continuous development of chips,thermal conductive plastics with electromagnetic shielding effectiveness have attracted much attention.This article briefly describes the principles of electromagnetic shielding and thermal conductivity,and summarizes the research progress of MXene based,carbon based,and metal based filler modified thermal conductive plastics with electromagnetic shielding effectiveness.

关 键 词：电磁屏蔽 导热 填料 改性 

分 类 号：T348[一般工业技术]