电子组件温度循环中的凝露问题研究  

Research on Condensation Problems of Electronic Assemblies under Temperature Cycling Experiments

作　　者：王雪冬 孔令华[1] 蒋庆磊[1] WANG Xuedong;KONG Linghua;JIANG Qinglei(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子质量》2024年第9期40-45,共6页Electronics Quality

摘　　要：详细地介绍了湿度、露点、呼吸效应等因素及其对凝露现象产生的作用机理。结合某型电子组件的温循试验过程,探讨温循过程中凝露产生的环节和根本原因,并提出了相应的解决措施。结果表明,凝露问题存在于温循过程中,升温阶段组件外表面产生凝露,降温阶段则在组件内部产生凝露。产生凝露现象的根源在于,高湿的空气环境造成较小的凝露温差,温差变化范围很小就会产生凝露现象。通过降低空气相对湿度、减缓降温速率的措施,可有效避免凝露问题的发生。Main factors such as humidity,dew-point,breathing effect and their mechanism on the condensation phenomenon are introduced in detail.Based on the temperature cycling test of an electronic assembly,the links and root causes of condensation during the temperature cycle are discussed,and corresponding solutions are proposed.Results show that condensation problem always exists during the temperature cycling.Condensation occurs on the outer surface of the component during the heating stage while inside the component during the cooling stage.The root cause of the condensation problems is that the high humidity air environment causes a small condensation temperature difference,and condensation will occur when the temperature difference changes within a very small range.Therefore,the occurrence of condensation problems can be effectively avoided by reducing the relative humidity of air and slowing down the cooling rate.

关 键 词：电子组件 温度循环试验 相对湿度 凝露 呼吸效应 

分 类 号：TN60[电子电信—电路与系统]