片间光互连发展态势分析(特邀)  

Analysis of the Development Trend of Inter-Chip Optical Interconnection

作　　者：刘璐 吴冰冰 LIU Lu;WU Bingbing(Institute of Technology and Standards,China Academy of Information and Communication Technology,Beijing 100191,China)

机构地区：[1]中国信息通信研究院技术与标准研究所,北京100191

出　　处：《光通信研究》2024年第5期14-18,共5页Study on Optical Communications

基　　金：国家重点研发计划资助项目(2021YFB2800203)。

摘　　要：随着各行业数字化转型升级进度加快,大数据和云计算等新技术的迅速普及应用,尤其是近两年来,人工智能大模型热潮兴起,带动算力需求快速增长。当前,电子信息技术遭遇带宽和能耗挑战,摩尔定律面临失效危机。相比于电信号,光信号具有传输带宽大、传输损耗小、抗干扰能力强和可并行传输等诸多优势,利用光进行互连成为信息技术发展的重要方向。当前,“光进铜退”趋势持续,光互连的应用场景从机架、板卡进入芯片。在单个芯片封装中集成光子和电子器件,不仅可以提高集成度和端口密度,还可以实现低能耗以及低时延。如何发展片间光互连,成为当前的研究热点之一。文章面向数字时代需求,针对算力基础设施两大典型应用场景——数据中心以及计算中心,梳理了片间光互连的最新技术动态,分析了产业生态与标准化进展,并研判其发展趋势。文章从技术、产业和应用等角度进行了深入探究,明确光互连可以从带宽、能耗和时延等方面有效提升数据中心中交换芯片与外部以及计算中心中计算芯片与外部之间的互连性能。当前片间光互连已取得初步进展,相关技术与标准化研究热度持续上升,产业得到初步落地。相较于数据中心,计算中心片间光互连技术的性能要求更高,产业化标准化进度更为滞后。整体来说,光互连的短距化将使光子进一步发挥自身优势和挖掘应用潜力,支撑信息通信技术的持续进步。With the acceleration of digital transformation and upgrading across various industries,the rapid popularization and application of new technologies such as big data and cloud computing have driven the exponential growth in demand for computing power,particularly with the emergence of artificial intelligence large models in recent years.Currently,electronic information technology faces challenges related to bandwidth limitations and energy consumption issues,while Moore’s law is confronted with potential failure.In comparison to electrical signals,optical signals offer numerous advantages including larger transmission bandwidth,minimal transmission loss,robust anti-interference capabilities,and parallel transmission.Consequently,optical interconnection has become a crucial direction for information technology development.The ongoing trend of"optical advance and copper retreat"continues as optical interconnection applications transition from racks and boards to chips.Integrating photonic and electronic devices within a single chip package not only enhances integration levels and port density but also achieves lower power consumption rates along with reduced latency periods.Developing inter-chip optical interconnections has emerged as one of the current research topics.The paper analyzes the latest technological trends in optical interconnects between chips,focusing on two key application scenarios of computing infrastructure:data centers and computing centers.It also analyzes the progress of industrial ecology and standardization,while evaluating its development trajectory.This paper conducts a comprehensive study from the perspectives of technology,industry,and application,elucidating that optical interconnection can effectively enhance the interconnection performance between the switching chip and external devices in data centers.It can also improve the performance between the computing chips and external devices in computing centers,with regards to bandwidth,energy consumption,and delay.Currently,there has be

关 键 词：数据中心 光电合封 光输入输出 光互连 

分 类 号：TN929[电子电信—通信与信息系统]