稀土Ce对高性能硅白铜焊料组织、析出和性能的影响规律研究  

Research on the Influence of Ce on the Microstructure,Precipitation and Properties of High-performance Silicon White Copper Solder

作　　者：贾飞 赵丹 程战 樊志斌 宁少晨 李小亮 JIA Fei;ZHAO Dan;CHENG Zhan;FAN Zhibin;NING Shaochen;LI Xiaoliang(China Academy of Machinery Ningbo Academy of Intelligent Machine Tool Co.,Ltd.,Ningbo 315700,China)

机构地区：[1]中国机械总院集团宁波智能机床研究院有限公司,浙江宁波315700

出　　处：《电焊机》2024年第10期32-41,共10页Electric Welding Machine

基　　金：河南省重大关键技术揭榜攻关项目(191110111000);宁波市“3315”人才计划2020年创新团队C类。

摘　　要：为研究Ce族稀土元素对高性能硅白铜焊料的凝固组织、固溶组织、时效析出行为和性能的影响规律。采用扫描电镜(SEM)、透射电镜(TEM)和电子探针(EPMA)等设备,对添加不同Ce含量的Cu-Ni-Si焊料进行组织观察和性能测试。结果表明:Ce族稀土元素的添加显著细化了硅白铜焊料的凝固组织,焊料凝固组织晶粒尺寸由未添加前的200μm减小到添加后的40μm。添加Ce元素抑制了焊料的固溶再结晶进程,细化了再结晶晶粒尺寸,添加Ce前再结晶温度为900℃,添加Ce后提高至950℃,添加Ce前再结晶晶粒尺寸为180μm,添加Ce后缩小为90μm。Ce元素的添加可促进Ni、Si元素的析出和抑制过时效阶段析出相的长大,但不改变时效析出相的类型,时效析出相为圆盘状的δ-Ni2Si和棒状的β-Ni3Si。Cu-3.2Ni-0.75Si-0.06Ce硅白铜焊料焊料在450℃时效4 h后达到最佳性能,抗拉强度为747 MPa,剪切强度为454 MPa,相较于未添加Ce元素的Cu-3.2Ni-0.75Si焊料,抗拉强度提高了117 MPa,增幅为18.6%,剪切强度提高了91 MPa,增幅25%。The aim of this paper is to study the influence of Ce-group rare earth elements on the solidification structure,solid solution structure,aging precipitation behavior,and properties of high-performance silicon white copper solder.Scanning electron microscopy(SEM),transmission electron microscopy(TEM),and electron probe microanalysis(EPMA)were used to observe the microstructure and test the properties of Cu-Ni-Si solders with different Ce contents.The results show that the addition of Ce-group rare earth elements significantly refines the solidification structure of the silicon white copper solder,reducing the grain size from 200μm to 40μm after addition.The addition of Ce elements inhibits the solid solution recrystallization process of the solder and refines the recrystallized grain size,increasing the recrystallization temperature from 900℃to 950℃and reducing the recrystallized grain size from 180μm to 90μm.The addition of Ce elements can promote the precipitation of Ni and Si elements and inhibit the growth of precipitated phases during the over-aging stage,but it does not change the type of aging precipitated phases,which are disk-shapedδ-Ni2Si and rod-shapedβ-Ni3Si.The Cu-3.2Ni-0.75Si-0.06Ce silicon white copper solder achieves the best performance after aging at 450℃for 4 h,with a tensile strength of 747 MPa and a shear strength of 454 MPa.Compared to the Cu-3.2Ni-0.75Si solder without Ce elements,the tensile strength is increased by 117 MPa,an increase of 18.6%,and the shear strength is increased by 91 MPa,an increase of 25%.

关 键 词：硅白铜焊料 Ce元素 固溶处理 时效析出 抗拉强度 

分 类 号：TG146.1[一般工业技术—材料科学与工程]