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作 者:周玉贵[1,2] 赵文璞[1] 李想 季惠明[1] Zhou Yugui;Zhao Wenpu;Li Xiang;Ji Huiming(Key Laboratory of Advanced Ceramics and Machining Technology,Ministry of Education,School of Materials Science and Engineering,Tianjin University,Tianjin 300350;Aerospace Institute of Advanced Materials&Processing Technology,Beijing 100074)
机构地区:[1]天津大学材料科学与工程学院,先进陶瓷及加工技术教育部重点实验室,天津300350 [2]航天特种材料及工艺技术研究所,北京100074
出 处:《化工新型材料》2024年第10期181-186,共6页New Chemical Materials
基 金:国家自然基金项目(51972222)。
摘 要:以甲基三甲氧基硅烷与乙烯基三乙氧基硅烷为原料,添加SiO_(2)气凝胶粉体,共同水解混合制备SiOC溶胶浆料,采用直写型3D打印和常压干燥制备SiOC基气凝胶,对其微观形貌、隔热及力学性能进行了探究。结果表明,该材料具有较低密度及收缩率,热导率为0.03665W/(m·K)。采用TEOS溶胶-凝胶法对其填充修饰后,热导率有效降低至0.017W/(m·K),抗压强度提高至1.87MPa。TEOS填充形成的SiO_(2)气凝胶填充了3D打印SiOC基气凝胶的宏观孔洞和内部的微米孔结构,有效降低了气相传热途径,从而提高了隔热性能。SiOC sol-gel slurry was prepared by co-hydrolysis and mixture using methyl trimethoxysilane(MTMS)and vinyl triethoxysilane(VETS)as raw materials and adding SiO_(2)aerogel powder.3D printing and ambient pressure drying were used to prepare SiOC-based aerogel,and the microscopic morphology,thermal insulation and mechanical properties of the samples were explored.The results showed that this aerogel had low density and shrinkage rate,with a thermal conductivity of 0.03665W·m^(-1)·K^(-1).After the 3D-printed SiOC-based aerogel was modified by filling with TEOS sol-gel,its thermal conductivity effectively reduced to as low as 0.017W·m^(-1)·K^(-1),and the compressive strength increased to 1.87MPa.The SiO_(2)aerogel formed by TEOS filling filled the macro pores and micro size macropore structure of 3D-printed SiOC-based aerogel,thus effectively reducing the gas phase heat transfer paths and improving the thermal insulation performance.
分 类 号:TB383[一般工业技术—材料科学与工程]
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