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作 者:张志祥 李逵 雷冰 刘曦[1] 马荟 ZHANG Zhixiang;LI Kui;LEI Bing;LIU Xi;MA Hui(Xi'an Institute of Microelectronics Technology,Xi'an 710054,China)
出 处:《微电子学与计算机》2024年第10期124-130,共7页Microelectronics & Computer
摘 要:围绕侵彻式月壤探测器中控制器的散热需求,结合侵彻着陆的实际工作过程进行分载荷步的瞬态热仿真分析,以获取各个关注器件在侵彻过程中的瞬时温度分布。针对散热瓶颈器件,提出增加热过孔及基板表面大面积铺铜的散热解决方案,仿真结果显示:散热瓶颈器件的散热效果改善明显。进一步,重点对控制器结构内主要热传导材料—灌封胶进行了关键热参数包括比热容和热导率的试验设计敏感度分析,通过二元线性回归分析可知灌封胶的比热容对器件温度影响更大,为模块灌封材料的选型提供参考。Focusing on the heat dissipation requirements of the controller in the penetrating lunar soil detector,this paper carries out the transient thermal simulation analysis by load steps in combination with the actual working process of the penetration landing,in order to obtain the instantaneous temperature distribution of each device of interest during the penetration process.Subsequently,a heat dissipation solution was proposed for the heat dissipation bottleneck devices,which included adding thermal via holes and laying copper on the surface of the substrate.Simulation results display that the temperature of the heat dissipation bottleneck devices decreases significantly.Further,the key thermal parameters including Specific heat capacity and thermal conductivity of potting adhesive,the main heat conduction material in the controller structure,were analyzed by Design of experiments Sensitivity analysis analysis.The binary linear regression analysis showed that the Specific heat capacity of potting adhesive had greater influence on the device temperature,providing a reference for the selection of module potting materials.
分 类 号:TN42[电子电信—微电子学与固体电子学]
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