基于分数阶黏弹性模型的HTPB推进剂残余应力演化过程研究  

Residual stress evolution process of HTPB propellant based on fractional viscoelastic model

作　　者：梁渊哲 任全彬[2] 何高让 郜婕 王新彤 LIANG Yuanzhe;REN Quanbin;HE Gaorang;GAO Jie;WANG Xintong(Xi’an Institute of Aerospace Solid Propulsion Technology,Xi’an 710025,China;Academy of Aerospace Solid Propulsion Technology,Xi’an 710025,China)

机构地区：[1]西安航天动力技术研究所,陕西西安710025 [2]航天动力技术研究院,陕西西安710025

出　　处：《推进技术》2024年第10期189-199,共11页Journal of Propulsion Technology

摘　　要：基于Grünwald-Letnikov离散格式,构建了基于ABAQUS二次开发的分数阶Kelvin模型材料本构。推导了三维下接近真实松弛实验边界条件的解析解公式,采用遗传算法对本构参数进行了精确辨识(相对误差小于6%)。通过单向拉伸松弛实验有限元模型计算验证了有限元计算结果收敛于解析解(相对误差小于3%)。最后采用松弛实验标定得到的本构参数,对HTPB推进剂固化降温过程及固化降温后残余应力松弛过程(10 h)进行了有限元计算。结果表明,固化降温后初期应力集中出现在中孔及人工脱粘层与药柱的分离处。随着松弛演化过程,药柱内部残余应力均下降,中孔及分离区处残余应力仍然显著大于其他区域,但中孔处应力梯度相对较小,分离处应力梯度显著大于其他区域。A fractional Kelvin model under ABAQUS-based secondary development was constructed by combining the Grünwald-Letnikov definition.The analytical solution formulas under the real relaxation experi⁃mental boundary conditions in three dimensions were derived,using the Genetic Algorithm to identify constitu⁃tive parameters(relative error less than 6%).The FEM of unidirectional tensile relaxation experiment is used to verify that the FEA calculation results converge to the analytical solution(relative error less than 3%).Finally,finite element calculations were conducted on the cooling process of HTPB propellant,as well as the residual stress relaxation process after solidification and cooling(10h).The results show that,after the cooling process,the stress concentrated at the middle hole and the separation of the stress releases boot and grain.As the relaxing process going on,the residual stress inside the grain decreases everywhere,and residual stress in the middle hole and separation area are still significantly greater than in other areas.However,the stress gradient in the middle hole is relatively small,and the stress gradient in the separation zone is significantly greater than in other areas.

关 键 词：HTPB推进剂 遗传算法 ABAQUS二次开发 分数阶Kelvin模型 固化降温 残余应力 

分 类 号：V512.3[航空宇航科学与技术—航空宇航推进理论与工程]