多材料体系三维集成光波导器件(特邀)  

Three-Dimensional Integrated Optical Waveguide Devices Based on Multi-Material Systems(Invited)

作　　者：王健 张宇 王康睿 赵世傲 赵晓阳 付天昊 蔡丞坤 Wang Jian;Zhang Yu;Wang Kangrui;Zhao Shiao;Zhao Xiaoyang;Fu Tianhao;Cai Chengkun(Wuhan National Laboratory for Optoelectronics,Huazhong University of Science and Technology,Wuhan 430074,Hubei,China;Optics Valley Laboratory,Wuhan 430074,Hubei,China)

机构地区：[1]华中科技大学武汉光电国家研究中心,湖北武汉430074 [2]湖北光谷实验室,湖北武汉430074

出　　处：《光学学报》2024年第15期22-46,共25页Acta Optica Sinica

基　　金：国家重点研发计划(2023YFB2806600);国家杰出青年科学基金(62125503);国家自然科学基金(62261160388,62105115);湖北省自然科学基金创新群体(2023AFA028)。

摘　　要：随着高速光通信、智能光计算和灵敏光探测等领域的快速发展,光子集成系统正成为重要发展趋势,其对于单元器件性能、系统集成度和可拓展性提出了更高的要求。多材料体系三维集成技术突破了传统单一材料体系的器件性能限制以及二维加工与集成技术的面积与集成度限制,有望实现高速率、高效率、高密度以及低功耗的新型光电集成系统。本文围绕三维堆叠技术和飞秒激光加工技术这两类主要的多材料体系三维集成光波导技术,首先介绍了基于层间耦合器的三维光学耦合技术与三维集成光波导器件,然后介绍了基于三维堆叠技术的光电融合集成器件(光发射机/接收机、波分复用收发器、光互连模块),进一步介绍了基于飞秒激光直写技术的三维集成光波导器件(偏振复用器、模式复用器、扇入/扇出器件、拓扑量子器件)。这些三维集成技术为提升系统性能、提高系统集成度以及降低系统功耗提供了有效的解决方案,从而在先进光通信和光信号处理等领域具有广泛的应用前景。Significance With the advent of big data and artificial intelligence eras,key enabling technologies such as high-capacity optical communication,high-performance computing,and high-sensitivity sensing and detection have experienced rapid development.Photonic integrated systems have attracted increasing attention,elevating demands on both the performance of basic building blocks and the overall integration and scalability of the system.Optical waveguides,fundamental units of optical interconnects in photonic integrated systems,offer notable advantages over traditional electrical wires,including higher data capacity,lower loss,and improved resistance to electromagnetic interference.Traditional optical waveguide structures are primarily fabricated using two-dimensional(2D)semiconductor fabrication processes,constraining light propagation to a single plane.Given that basic photonic building blocks face diffraction limits,achieving device miniaturization through advanced fabrication technology nodes,unlike those in microelectronics,is challenging.Therefore,the number of integrated devices on a single chip is limited by the chip’s footprint.To overcome these constraints of traditional 2D integration technology,there is an escalating need for three-dimensional(3D)integration techniques,which promise superior performance and increased integration density.The silicon photonic platform,compatible with complementary metal oxide semiconductor processes,is vital for photonic integrated devices.Currently,various photonic devices have been realized on the silicon-on-insulator platform,encompassing low-loss optical waveguides,passive optical waveguide devices,high-speed modulators,and detectors.As integrated systems become more complex,routing waveguides on a single device layer becomes more challenging.Efficient interlayer coupler structures capable of routing the light into another device layer facilitate waveguide routing in 3D stacked photonic structures.These interlayer couplers not only enable vertical light transmission

关 键 词：集成光子学 三维堆叠 飞秒激光直写 多材料体系 光电融合 三维集成光波导器件 

分 类 号：O436[机械工程—光学工程]