电阻丝Ag-Cu合金的组织与性能研究  

Study on Microstructure and Properties of Resistance Wire Ag-Cu Alloy

作　　者：马晓东 沈大吉 王金刚 张春瑞 刘开强 李旭 MA Xiaodong;SHEN Daji;WANG Jingang;ZHANG Chunrui;LIU Kaiqiang;LI Xu(Xi'an Noble Rare Metal Materials Co.,Ltd.,Univ.,Xi'an 710201,China)

机构地区：[1]西安诺博尔稀贵金属材料股份有限公司,陕西西安710201

出　　处：《电工材料》2024年第5期4-6,共3页Electrical Engineering Materials

摘　　要：Ag-Cu合金作为电阻丝广泛应用于电路保护、电子元器件等电工电子行业。采用真空熔炼及冷拉拔工艺制备AgCu55合金丝材,并深入探究不同退火温度下合金的微观结构变化以及加工率对AgCu合金性能的影响。试验结果表明,随着退火温度的提升,合金中纤维状共晶片层逐步粗化,导致硬度降低;300℃退火后,富铜颗粒以球形形态析出,并弥散分布在纤维结构中,电阻率随着加工率的增加而增加。Ag-Cu alloy is widely used as a resistance wire in the electrical industry such as circuit protection and electronic components.AgCu55 alloy wire was prepared by vacuum melting and cold drawing process,and the microstructure changes of the alloy at different annealing temperatures and the effects of processing rate on the properties of silver copper alloy were investigated.The results show that the fibrous eutectic layer thickens and the hardness gradually decreases with the increase of annealing temperature;after spheroidization at 300℃,copper-rich particles precipitate and disperse in the fiber strip;the electrical resistivity increases with the increase of processing.

关 键 词：AgCu合金 显微组织 硬度 电阻率 

分 类 号：TM241[一般工业技术—材料科学与工程]