Z-pin增强防隔热复合材料研究现状及发展趋势  

Research status and development trend of Z-pin reinforced anti-heat insulation composites

作　　者：胡泽辉 李勇[1] 还大军[1] 韩冰 郭达 HU Zehui;LI Yong;HUAN Dajun;HAN Bing;GUO Da(School of Materials Science and Engineering,Nanjing University of Aeronautics&Astronautics,Nanjing 211106,China)

机构地区：[1]南京航空航天大学材料科学与技术学院,南京211106

出　　处：《复合材料科学与工程》2024年第9期125-132,共8页Composites Science and Engineering

摘　　要：未来新型航天飞行器具有飞行速度快、航行时间长等特点,已成为世界各航天大国的重要研究热点。为保障飞行器在长时间承受气动加热条件下安全飞行,防隔热复合材料的应用起到至关重要的作用。目前,针对航天飞行器防热复合材料存在层间性能薄弱、制备效率低,隔热陶瓷基复合材料夹层结构芯材性能薄弱、采用手工缝合增强的现状,文章从设计、制备及应用等方面分析总结了国内外防隔热复合材料及Z-pin增强技术研究现状,提出了我国未来Z-pin增强防隔热复合材料技术的发展趋势。Future new space vehicles,characterized by fast flight speed and long navigation time,have become an important research hotspot for the world’s space powers.In order to guarantee the safe flight of the vehicle under aerodynamic heating conditions for a long time,the application of anti-insulation composite materials plays a crucial role.At present,in view of the weak interlayer performance and low preparation efficiency of heat protection composites for space vehicles,and the weak core material performance of heat protection ceramic-based composite sandwich structure and hand-stitching enhancement,the article analyses and summarizes the current research status of domestic and foreign research on heat protection composites and Z-pin enhancement technology from the aspects of design,preparation and application,and puts forward the development trend of China’s future Z-pin enhancement technology of heat protection composites.

关 键 词：复合材料 航天飞行器 防隔热复合材料 Z-PIN 

分 类 号：TB332[一般工业技术—材料科学与工程]