3D打印非晶合金研究进展及空间应用展望  

Advances in research on 3D printed metallic glasses andprospects for space applications

在线阅读下载全文

作  者:封国宝 李亚峰[1] 王琪[1] 张恒 苗光辉 李韵[1] 胡天存[1] 郭诚 FENG Guobao;LI Yafeng;WANG Qi;Zhang Heng;MIAO Guanghui;LI Yun;HU Tiancun;GUO Cheng(China Academy of Space Technology(Xi’an),Xi’an 710000,China;Faculty of Electronic and Information Engineering,Xi’an Jiaotong University,Xi’an 710049,China)

机构地区:[1]中国空间技术研究院西安分院空间微波通信全国重点实验室,西安710000 [2]西安交通大学电子与信息学部,西安710049

出  处:《空间电子技术》2024年第5期1-10,F0002,共11页Space Electronic Technology

基  金:自然科学基金面上项目(编号:12175176);国家重点实验室基金项目(编号:2022-JCJQ-LB-006);碑林区科技计划项目(编号:GX2234);民用航天预先研究项目(编号:D010203)

摘  要:面向空间极端化境的高适应非晶合金器件易于采用3D打印成型,同时能有效实现空间载荷的一体化和轻量化。文章针对3D打印非晶合金综述了在制备和性能方面的研究进展,介绍了3D打印工艺的主要技术特点、成型影响因素和几种主要的非晶合金材料类型,以及微波器件关注的表面粗糙度以及表面电导率研究现状,并展望了3D打印非晶合金在面向空间载荷上的应用前景。文章阐述的内容可为空间3D打印技术和非晶合金的在轨高可靠应用提供技术参考。The technological trend towards the integration,lightweight,and high reliability of space microwave payloads is facilitated by the extreme temperature variation rates,enabling the fabrication of highly reliable metallic glass devices that are resistant to the harsh space environment through 3D printing.Concurrently,microwave cavities manufactured using 3D printing technology can effectively achieve material monolithicity.This paper provides a comprehensive review of the research advancements in the preparation and performance of 3D printed metallic glasses.It outlines the principal technical characteristics and influencing factors of the 3D printing process,the predominant types of amorphous alloy materials,and the current state of research on surface roughness and surface electrical conductivity,which are critical for microwave device applications.The paper also discusses the prospective applications of 3D printed metallic glass devices in the context of space microwave payloads.The content presented herein offers technical insights for the in-orbit high-reliability applications of space 3D printing technology and metallic glasses.

关 键 词:3D打印 非晶合金 微波载荷 

分 类 号:TN253[电子电信—物理电子学] V443[航空宇航科学与技术—飞行器设计]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象