钼及钼合金板材再结晶显微组织与性能的研究  

Recrystallization Microstructure and Properties of Molybdenum and Molybdenum Alloy Plates

作　　者：郭雪琪 申坤瑞 郭鑫晴 赵虹淳 GUO Xueqi;SHEN Kunrui;GUO Xinqing;ZHAO Hongchun(ATTL Advanced Materials Co.,Ltd.,Tianjin 301800,China)

机构地区：[1]安泰天龙钨钼科技有限公司,天津301800

出　　处：《中国钼业》2024年第5期46-51,共6页China Molybdenum Industry

摘　　要：研究了Mo、MoLa、Mo-50W 3种板材的再结晶显微组织及其性能。结果表明:MoLa板再结晶退火温度比Mo板高100℃,Mo-50W板再结晶退火温度比Mo板提高了400℃;Mo-50W板硬度值明显高于MoLa板,MoLa板与Mo板对比硬度值变化不明显;钼及钼合金板的抗拉强度均随着退火温度的升高而不断降低。Recrystallization microstructure and properties of Mo,MoLa and Mo-50W were studied.The results show that the annealing temperature of MoLa plate is 100℃higher than that of Mo plate,and the annealing temperature of Mo-50W plate is 400℃higher than that of Mo plate;the hardness value of Mo-50W plate is significantly higher than that of MoLa plate,and the contrast change of MoLa plate and Mo plate is not obvious;the tensile strength of molybdenum and molybdenum alloy plate is constantly decreasing with the increase of annealing temperature.

关 键 词：再结晶 金相组织 力学性能 

分 类 号：TG146.4[一般工业技术—材料科学与工程]