A comprehensive review of radiation effects on solder alloys and solder joints  

作　　者：Norliza Ismail Wan Yusmawati Wan Yusoff Nor Azlian Abdul Manaf Azuraida Amat Nurazlin Ahmad Emee Marina Salleh 

机构地区：[1]Department of Physics,Centre for Defence Foundation Studies,Universiti Pertahanan Nasional Malaysia,Kem Sungai Besi,Kuala Lumpur 57000,Malaysia [2]Department of Mineral and Geoscience Malaysia,Mineral Research Centre,Jalan Sultan Azlan Shah,Ipoh 31400,Perak,Malaysia

出　　处：《Defence Technology（防务技术）》2024年第9期86-102,共17页Defence Technology

基　　金：fully supported by a Tabung Amanah Pusat Pengurusan Penyelidikan dan Inovasi (PPPI) grant (UPNM/2023/GPPP/SG/1);Universiti Pertahanan Nasional Malaysia (UPNM) for funding this study。

摘　　要：In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.

关 键 词：Defence technology Solder alloy Solder joints Radiation-induced effect MICROSTRUCTURE Mechanical properties 

分 类 号：TG40[金属学及工艺—焊接]