倒装LED晶片在全彩Mini LED显示屏中的精确组装与校正技术研究  

Research on Precision Assembly and Calibration Technology for Inverted LED Chip in Full Color Mini LED Display Panel

作　　者：张妮 ZHANG Ni(Shenzhen Juphy Optoelectronics Co.,Ltd.,Shenzhen 518100,China)

机构地区：[1]深圳市聚飞光电股份有限公司,广东深圳518100

出　　处：《中国照明电器》2024年第9期31-33,共3页China Light & Lighting

摘　　要：本文旨在通过倒装LED晶片转移封装工艺、行列驱动电路设计、高精度拼装结构和整屏校正技术等研究,开发倒装COB高清小间距无缝拼接LED显示屏。通过解决关键技术问题,实现了显示屏的开发。该显示屏具有黑屏墨色一致性、白屏各视角一致性、整屏一致性以及高焊接良率等优点。行列驱动电路设计采用列恒流芯片+行驱动芯片,达到了低功耗、高表面温度控制和低灰效果;精确的拼装结构设计实现了高精度平整度和快速安装更换;校正技术解决了亮度和色彩一致性问题。该研究成果为倒装COB高清小间距无缝拼接LED显示屏的开发提供了技术路线和解决方案,将会进一步推动LED显示屏技术的发展,提升用户体验。The purpose of this research is to develop flip-chip COB high definition small pitch seamless spliced LED display.The research contents include flip-chip LED transfer packaging technology,row-and-row drive circuit design,high-precision assembly structure and whole-screen correction technology.By solving the key technical problems,the development of the display screen is realized.In this paper,flip-chip COB technology is used to realize LED wafer stabilization and high yield welding.The design of row-column driving circuit adopts column constant current chip+Row driving chip to realize low power consumption,high surface temperature control and low ash effect.Accurate assembly structure design to achieve high-precision flatness and rapid installation and replacement.The calibration technique solves the problem of brightness and color consistency.The research results provide a technical route and solution for the development of flip-chip COB high definition and small pitch seamless spliced LED display.The display screen has many advantages,will promote the development of LED display technology,enhance the user display experience.

关 键 词：小间距 无缝拼接 显示屏 转移封装工艺 行列驱动 拼装结构 校正技术 

分 类 号：TN873[电子电信—信息与通信工程]