Fabrication and evaluation of high-performance 3D interpenetrated network structures SiC/Al composites with high-purity plate-like a-SiC framework  

作　　者：Jiawei Xie Jinhui Zou Liangcheng Tong Syieluing Wong Xin Guo Hang Qin Pengzhao Gao Wenming Guo Hanning Xiao 

机构地区：[1]College of Materials Science and Engineering,Hunan University,Changsha,410082,China [2]Department of Chemical Engineering and Chemistry,Eindhoven University of Technology,Eindhoven,5612 AZ,Netherlands [3]College of Automation and Information Engineering,Xi'an University of Technology,Xi'an,710048,China

出　　处：《Journal of Materiomics》2024年第2期499-510,共12页无机材料学学报（英文）

基　　金：support from the National Natural Science Foundation of China(52202060);the Fundamental Research Funds for the Central Universities of Hunan University(531118010545);the Natural Science Foundation of Hunan Province(2021JJ40174,2021JJ40088,2022JJ30133),and Chinese Academy of Sciences Technical Institute of Physics and Chemistry provided b-SiC powder.

摘　　要：To reinforce compatibility with the thermophysical and mechanical properties of SiC/Al composites for electronic packaging to improve the stability and reduce fatigue failure of electronic integrated devices,a novel 3D SiC reinforced framework with interpenetrated plate-like a-SiC grains was synthesized.A small amount of doped a-SiC was seeded to induce the transformation of b-SiC to plate-like a-SiC at 2,300℃,forming a high-purity a-SiC strongly bonded framework.Vacuum/gas pressure infiltration of Al alloy was subsequently used to manufacture the 3D interpenetrated network structure SiC/Al(SiC3D/Al)composite.Characterization results showed that 15%(in mass)seeds provided the composite with the optimal comprehensive performance,including a low coefficient of thermal expansion(CTE)of 5.54×10^(-6)K^(-1),a high thermal conductivity(l)of 239.08 W·m^(-1)·K^(-1),the highest flexural strength of 326.84 MPa,and a low thermal deformation parameter(TDP)of 0.023.High-purity plate-like grains enhanced the purity of the framework promoting a significant improvement in l.As the seed content increased to 20%(in mass),both CTE and l reached optimal values of 5.22×10^(-6)K^(-1)and 243.14 W·m^(-1)·K^(-1),but the mechanical properties declined by 10.30%.The synergistic effect of the well-bonded interface and the high-purity 3D SiC framework balanced excellent mechanical properties and multiple thermal functions.

关 键 词：α-SiC seed Phase transformation Thermophysical properties SiC_(3D)/Al composites Electronic packaging 

分 类 号：TB33[一般工业技术—材料科学与工程]