Sn和Ni对过冷Ag-28.1Cu共晶合金凝固组织的影响  

Effects of addition of Sn and Ni elements on the solidification structure of undercooled Ag-28.1Cu eutectic alloy

作　　者：李宏 金青林[1] 林水根 LI Hong;JIN Qinglin;LIM Sugun(Faculty of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;Gyeongsang National University,Jinju 52636,Korea)

机构地区：[1]昆明理工大学材料科学与工程学院,昆明650093 [2]韩国国立庆尚大学,庆尚南道晋州市52636

出　　处：《材料科学与工艺》2024年第5期50-57,共8页Materials Science and Technology

基　　金：国家自然科学基金青年基金资助项目(52101040),。

摘　　要：为了揭示在共晶相中具有不同固溶度的Sn和Ni元素对过冷共晶凝固组织的影响和作用机理,使用熔融玻璃净化和循环过热相结合的方法制备了过冷Ag-28.1Cu-xM(x=0%0.5%、1%,质量分数;M=Sn,Ni)共晶合金试样,分析了第3组元Sn和Ni对过冷Ag-Cu共晶合金凝固组织的影响。结果表明添加Sn元素不会改变宏观组织的分区特征,微观组织中出现反常共晶增多和粗化的现象,并具有随机的取向分布。凝固过程中Sn会形成垂直于固-液界面的浓度梯度,造成胞状界面失稳形成树枝状,但仍能够维持耦合共晶生长。而添加Ni元素会使宏观组织的分区特征消失,微观组织中则出现了单相枝晶,且表现出单一取向分布,原因是第3组元Ni平行于固-液界面扩散,使共晶合金生长方式从耦合生长转变为离异生长。In order to reveal the influence and mechanism of Sn and Ni elements with different solid solubility in eutectic phase on the undercooled eutectic solidification structure,Ag-28.1Cu-xM(x=Owt.%,0.5wt.%,1wt.%;M=Sn,Ni)eutectic alloys were prepared using a combination of molten glass purification and cyclic superheating method.The effect of the third component Sn and Ni on the solidification structure of undercooled Ag-Cu eutectic alloy was investigated.The results showed that the addition of Sn did not change the macroscopic zoning characteristics of the microscructure.Moreover,an anomalous increase in eutectic and coarsening was observed in the microstructure,with a random orientation distribution.During solidification,Sn formed a concentration gradient perpendicular to the solid-liquid interface,resulting in the instability of the cellular interfaces and the formation of dendrites,but still maintaining coupled eutectic growth.While the addition of Ni eliminated the macroscopic zoning characteristics.In the microstructure,single-phase dendrites were formed,exa single orientation distribution.This is because Ni diffused parallel to the solid-liquid interface,causing the eutectic alloy growth to transit from coupled growth to decoupled growth.

关 键 词：Ag-28.1Cu共晶合金 深过冷 合金元素Sn和Ni 凝固组织 EBSD 

分 类 号：TG146[一般工业技术—材料科学与工程]