Improving bonding strength of W/Cu dual metal interface through laser microstructuring method  

作　　者：Xing Li Quanjie Wang Libing Lu Yingchun Guan Wei Zhou 

机构地区：[1]Hefei Innovation Research Institute of Beihang University,Hefei,230012,China [2]Ningbo Institute of Technology,Beihang University,Ningbo,315832,China [3]School of Mechanical Engineering and Automation,Beihang University,Beijing,100191,China [4]National Engineering Laboratory of Additive Manufacturing for Large Metallic Components,Beihang University,Beijing,100191,China [5]School of Mechanical and Aerospace Engineering,Nanyang Technological University,50 Nanyang Avenue,639798,Singapore

出　　处：《Light(Advanced Manufacturing)》2024年第3期86-92,共7页光（先进制造）（英文）

基　　金：supported by the Key Research and Development Program of the Anhui Province(202004b11020030).

摘　　要：Selective laser melting(SLM)is a promising technology for fabricating complex components with W/Cu dual metal.To enhance the interfacial bonding of W/Cu dual metal,we propose a novel approach using laser texturing to fabricate micro/nanostructures on the W surface.The micro/nanostructures promoted the spreading of Cu in the liquid,inhibited defects,and considerably increased the contact area between W and Cu by mechanical interlocking.To the best of our knowledge,a W/Cu dual metal was successfully prepared by SLM without a transition layer the first time.The bonding strength of the two materials reached 123 MPa,close to that of a W/Cu dual metal joint prepared by diffusion bonding.

关 键 词：W/Cu dual metal Selective laser melting Laser texturing Mechanical interlocking Tensile properties 

分 类 号：TN24[电子电信—物理电子学]