The on-chip thermoelectric cooler:advances,applications and challenges  

作　　者：Chengjun Li Yubo Luo Wang Li Boyu Yang Chengwei Sun Wenyuan Ma Zheng Ma Yingchao Wei Xin Li Junyou Yang 

机构地区：[1]State Key Laboratory of Materials Processing and Die&Mould Technology,School of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China

出　　处：《Chip》2024年第2期96-108,共13页芯片（英文）

基　　金：supported by the National Natural Science Foundation of China(Grant No.92163211 and 52002137);the Fundamental Research Funds for the Central Universities(Grant No.2021XXJS008).

摘　　要：With the development of 5G technology and increasing chip integration,traditional active cooling methods struggle to meet the growing thermal demands of chips.Thermoelectric coolers(TECs)have garnered great attention due to their rapid response,significant cooling differentials,strong compatibility,high stability and controllable device dimensions.In this review,starting from the fundamental principles of thermoelectric cooling and device design,high-performance thermoelectric cooling materials are summarized,and the progress of advanced on-chip TECs is comprehensively reviewed.Finally,the paper outlines the challenges and opportunities in TEC design,performance and applications,laying great emphasis on the critical role of thermoelectric cooling in addressing the evolving thermal management requirements in the era of emerging chip technologies.

关 键 词：CHIP Thermal management Thermoelectric materials Thermoelectric cooler Cooling performance 

分 类 号：TN4[电子电信—微电子学与固体电子学] TN929.5