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作 者:杨开泰 张子春 孔梁 Yang Kaitai;Zhang Zichun;Kong Liang(Aeronautics Computing Technology Research Institute,Xi’an Shaanx 710065,China)
机构地区:[1]中国航空工业集团公司西安航空计算技术研究所,陕西西安710065
出 处:《山西电子技术》2024年第5期33-35,共3页Shanxi Electronic Technology
摘 要:针对小型化、高密化PCB设计中的同层串扰以及层间串扰对于信号完整性的影响日益突出问题,提取传输线串扰模型,基于传输线互容互感进行串扰原理分析,在此基础上进行相同耦合长度、相同走线间距的信号同层串扰以及层间串扰建模,最后利用ANSYS软件进行串扰仿真分析,通过仿真结果可以看出,相同条件下层间串扰强度明显大于同层串扰,因此在PCB设计中必须避免相邻层重合走线,以减小信号的串扰强度。In miniaturized and high-density PCB design,the problem of intra-layer crosstalk and inter-layer crosstalk on signal integrity is increasing,the transmission line crosstalk model is extracted in the paper,and the crosstalk principle is analyzed based on the mutual capacity and mutual inductance of transmission lines.On this basis,the signal intra-layer crosstalk and inter-layer crosstalk modeling with the same coupling length and the same line spacing are carried out.Finally,ANSYS software is used to conduct crosstalk simulation analysis.Through the simulation results,it can be seen that the inter-layer crosstalk intensity is obviously greater than that of intra-layer crosstalk,so it is necessary to avoid the overlapping of adjacent layers in PCB design to reduce the crosstalk intensity of signals.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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