Improving comprehensive properties of Cu-11.9Al-2.5Mn shape memory alloy by adding multi-layer graphene carried by Cu_(51)Zr_(14)inoculant particles  

通过添加Cu_(51)Zr_(14)孕育剂颗粒承载的多层石墨烯提高Cu-11.9Al-2.5Mn形状记忆合金的综合性能

作　　者：Zhi-xian JIAO Qing-zhou WANG Yan-jun DING Fu-xing YIN Chao-hui XU Cui-hong HAN Qi-xiang FAN 焦志娴;王清周;丁燕军;殷福星;徐超辉;韩翠红;范其香(天津职业技术师范大学机械工程学院,天津300222;河北工业大学材料科学与工程学院,天津市材料层状复合与界面控制技术重点实验室,天津300130;中南大学材料科学与工程学院,长沙410083;广东省科学院新材料研究所,广州510651)

机构地区：[1]School of Mechanical Engineering,Tianjin University of Technology and Education,Tianjin 300222,China [2]Tianjin Key Laboratory of Materials Laminating Fabrication and Interface Control Technology,School of Materials Science and Engineering,Hebei University of Technology,Tianjin 300130,China [3]School of Materials Science and Engineering,Central South University,Changsha 410083,China [4]Institute of New Materials,Guangdong Academy of Sciences,Guangzhou 510651,China

出　　处：《Transactions of Nonferrous Metals Society of China》2024年第10期3265-3281,共17页中国有色金属学报（英文版）

基　　金：supported by the Natural Science Foundation of Hebei Province,China(No.E2021202017);the National Natural Science Foundation of China(No.52061038);the Foundation Strengthening Program,China(No.2019-JCJQ-ZD-142-00);the Hebei Province Graduate Innovation Funding Project,China(No.CXZZBS2022032);the Jiangsu Provincial Policy Guidance Program(Special Project for the Introduction of Foreign Talents)Talent Introduction Program,China(No.BX2021024);the Science Plan Foundation of Tianjin Municipal Education Commission,China(No.2021KJ026)。

摘　　要：In order to improve the comprehensive properties of the Cu-11.9Al-2.5Mn shape memory alloy(SMA),multilayer graphene(MLG)carried by Cu_(51)Zr_(14)inoculant particles was incorporated and dispersed into this alloy through preparing the preform of the cold-pressed MLG-Cu_(51)Zr_(14)composite powders.In the resultant novel MLG/Cu-Al-Mn composites,MLG in fragmented or flocculent form has a good bonding with the Cu-Al-Mn matrix.MLG can prevent the coarsening of grains of the Cu-Al-Mn SMA and cause thermal mismatch dislocations near the MLG/Cu-Al-Mn interfaces.The damping and mechanical properties of the MLG/Cu-Al-Mn composites are significantly improved.When the content of MLG reaches 0.2 wt.%,the highest room temperature damping of 0.0558,tensile strength of 801.5 MPa,elongation of 10.8%,and hardness of HV 308 can be obtained.On the basis of in-depth observation of microstructures,combined with the theory of internal friction and strengthening and toughening theories of metals,the relevant mechanisms are discussed.为了提高Cu-11.9Al-2.5Mn形状记忆合金(SMA)的综合性能,通过制备多层石墨烯(MLG)-Cu_(51)Zr_(14)复合粉末冷压预制体,将MLG由Cu_(51)Zr_(14)孕育剂颗粒承载后添加并分散于该合金中。在所制备的新型MLG/Cu-Al-Mn复合材料中,碎片状或絮状的MLG与Cu-Al-Mn基体结合良好。MLG可以阻碍Cu-Al-MnSMA晶粒的粗化,并在MLG/Cu-Al-Mn界面附近产生热失配位错。MLG/Cu-Al-Mn复合材料的阻尼和力学性能显著提高,当MLG的含量达到0.2%(质量分数)时,其最高室温阻尼为0.0558,抗拉强度为801.5 MPa,伸长率为10.8%,硬度为HV 308。基于深入的显微组织观察,结合内耗理论以及金属的强韧化理论,对相关机理进行讨论。

关 键 词：Cu−Al−Mn shape memory alloy multilayer graphene(MLG) microstructure interface damping mechanical properties 

分 类 号：TG139.6[一般工业技术—材料科学与工程]