Preparation and Characterization of ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)System Low Melting Sealing Glasses  

ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)低熔点封接玻璃的制备及表征

作　　者：HE Yifeng LI Xiuying LI Chaoyuan GUO Huiming XIAO Zhuohao ZHU Shengbin DONG Hongbo FU Zhen 贺一峰;李秀英;李朝圆;郭慧明;肖卓豪;朱圣斌;董洪波;付震(景德镇陶瓷大学材料科学与工程学院,江西景德镇333403;临沂大学,山东临沂276005;山东景耀玻璃集团有限公司,山东临沂276624)

机构地区：[1]School of Material Science and Engineering,Jingdezhen Ceramic University,Jingdezhen 333403,Jiangxi,China [2]Linyi University,Linyi 276005,Shandong,China [3]Shandong Jingyao Glass Group Co.,Ltd.,Linyi 276624,Shandong,China

出　　处：《陶瓷学报》2024年第5期931-940,共10页Journal of Ceramics

基　　金：National Natural Science Foundation of China(52172070);Jiangxi Provincial Natural Science Foundation(20242BAB25222);Jiangxi Provincial Graduate Innovation Special Fund Project(YC2022-S882 and YC2023-S808).

摘　　要：Lead-free low melting glasses,ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)system,with fixed contents of 15 mol%CuO and 20 mol%Bi_(2)O_(3),were prepared by using melt cooling method.Structure and thermal properties of the glasses were studied by using X-ray diffractometer(XRD),infrared spectrometer(FIT-IR),thermal dilatometer and differential thermal analyzer(DTA).Chemical durability of the glasses was studied by using dissolution rate method.Wettability of glasses on substrate was tested by using button sintering experiment.It is found that alkaline resistance of the glass solders is lower than that of plate glass and the water resistance is comparable with that of plate glass.The sealing temperatures are Ts=445-490℃,while the average thermal expansion coefficient from room temperature to 300℃is in the range of(65-82)×10^(−7)℃^(−1).At sealing temperature,the glass solders have good wettability on plate glass or alumina substrate.They are not crystallized even sintered at the sealing temperature for 30 min.The solder glasses are suitable for sealing plate glass,alumina and other inorganic non-metallic materials.采用熔体冷却法制备了CuO和Bi_(2)O_(3)含量分别固定为15 mol%和20 mol%的ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)体系无铅低熔点玻璃。采用X射线衍射仪(XRD)、红外光谱仪(FIT-IR)、差热分析仪(DTA)和热膨胀仪研究了玻璃的结构和热性能;溶解速率法研究玻璃的化学稳定性;纽扣烧结实验研究玻璃在基片上的润湿性。研究结果表明:所制备低熔点玻璃焊料的耐通过碱性低于平板玻璃,耐水性可与平板玻璃相媲美;封接温度Ts=445℃~490℃,热膨胀系数α20℃~300℃=65~82×10^(−7)℃^(−1);封接温度下玻璃焊料在平板玻璃或氧化铝基片的润湿性能好,且在封接温度下保温30 min不析晶,为非结晶型焊料;本文所制备的玻璃焊料适用于封接平板玻璃、氧化铝等无机非金属材料。

关 键 词：bismuth borate glass solder glasses WETTABILITY chemical durability thermal properties 

分 类 号：TQ174.75[化学工程—陶瓷工业]