电子设备外壁自然散热综合传热系数仿真研究  

Simulation of Complex Heat Transfer Coefficient During Natural Cooling of Electronic Device External Walls

作　　者：卢昕博[1] 滕如玉 陈嘉彬 蒋健[1] 韩玉峰 詹望成[2] 周国俊[1] 肖卫强[1] LU Xinbo;TENG Ruyu;CHEN Jiabin;JIANG Jian;HAN Yufeng;ZHAN Wangcheng;ZHOU Guojun;XIAO Weiqiang(Technology Center,China Tobacco Zhejiang Industrial Co.Ltd,Hangzhou 310008,China;Institute of Industrial Catalysis,East China University of Science and Technology,Shanghai 200237,China;Shenzhen Tobacco Industrial Co.Ltd,Shenzhen 518110,Guangdong,China)

机构地区：[1]浙江中烟工业有限责任公司技术中心,杭州310008 [2]华东理工大学工业催化研究所,上海200237 [3]深圳烟草工业有限责任公司,广东深圳518110

出　　处：《华东理工大学学报（自然科学版）》2024年第5期659-667,共9页Journal of East China University of Science and Technology

基　　金：教育部基本科研业务费;中国烟草总公司科技项目。

摘　　要：采用Boussinesq假设对计算流体动力学中的自然对流传热行为进行研究,考察了电子设备外壁自然对流过程的传热特性。通过分析水平、竖直壁面和圆柱、球体曲面的自然对流过程,建立了自然对流传热系数公式。同时,研究了电子设备在工作环境下的辐射传热行为,简化了辐射传热方程,获得辐射传热系数公式。在此基础上,整合对流传热系数公式和辐射传热系数公式,获得和壁面温度相关的综合传热系数公式,该公式可以快速计算电子设备外壁与环境之间的传热量,为电子设备的热管理设计提供更为便捷和有效的研究手段。This study exploits computational fluid dynamics(CFD)to simulate the natural convection heat transfer behavior of the external wall of an electronic device.The simulation analyzes and calculates convective heat dissipation using Boussinesq approximation,aiming to understand the heat-transfer characteristics of the natural convection process occurring on the wall.The heat transfer characteristics are analyzed by categorizing them into two types——the convective and radiative.Formulas for natural convection heat transfer coefficients are developed by analyzing natural convection processes on horizontal and vertical walls,as well as on cylindrical and spherical surfaces.Through an analysis of the natural convection heat transfer characteristics,approaches to improve heat transfer efficiency between the outer wall of electronic devices and the environment are proposed.Additionally,the radiation heat transfer behavior of the electronic device within its operational environment is investigated.The radiation heat transfer equation is simplified to determine the radiation heat transfer coefficient.Building upon these findings,a comprehensive heat transfer formula related to wall temperature is established by integrating convection and radiation heat transfer coefficients.Using this comprehensive heat transfer formula,the heat transfer amount can be quickly calculated when the outer wall temperature of the electronic device is known.The results enable a rapid calculation of heat transfer between the outer wall of the electronic device and its surrounding environment,and provide a more convenient and effective approach in the thermal management design and optimization of heat dissipation for electronic devices.

关 键 词：BOUSSINESQ 计算流体动力学 自然对流 辐射 综合传热系数 

分 类 号：TB24[一般工业技术—工程设计测绘]