聚四氟乙烯PCB埋置空腔制作研究  

Research on process of air-cavity embedded in PTFE PCB

作　　者：王立刚 邹冬辉 叶霖 陶锦滨 WANG Ligang;ZOU Donghui;YE Lin;TAO Jinbin(Shenzhen Q&D Circuits Co.,Ltd.,Shenzhen 518103,Guangdong,China)

机构地区：[1]深圳市强达电路股份有限公司,广东深圳518103

出　　处：《印制电路信息》2024年第10期16-19,共4页Printed Circuit Information

摘　　要：聚四氟乙烯(PTFE)材料拥有优异的耐高低温性能和化学稳定性,能提供极低的介电常数和损耗系数,因而广泛应用于微波高频信号传输领域的印制电路板(PCB)。PCB内埋空腔是将空气腔体内置板内,使内层传输线的上方填充空气,进一步降低传输线损耗系数。以罗杰斯PTFE材料作为基材制作PCB内埋空腔,探讨该类PCB空腔的设计与制作。polytetrafluoroethylene(PTFE)materials can provide extremely low dielectric constant and loss coefficient,and have excellent high and low temperature resistance and chemical stability,so they are widely used in microwave high-frequency signal transmission.Printed circuit board(PCB)with embedded air-cavity is to build the air-cavity into the board,so that the top of the inner transmission line is filled with air,further reducing the dielectric parameters and loss coefficient of the transmission line environment.In this way,high-quality high-speed transmission of signals can be realized.In this paper,Rogers PTFE materials are used as the base material to make embedded aircavity in PCB,and the design and fabrication of air-cavity in PTFE PCB are discussed.

关 键 词：聚四氟乙烯 空气腔体 微波 高频传输 

分 类 号：TN41[电子电信—微电子学与固体电子学]