刚挠板中非隔空多层软板的分层研究  

Research on the delamination of flexible multilayer with no air gap in rigid-flex PCB

作　　者：杨先卫 陈蓓 黄英海 YANG Xianwei;CHEN Bei;HUANG Yinghai(Sunshine Global Circuits Co.,Ltd.,Shenzhen 518000,Guangdong,China)

机构地区：[1]深圳明阳电路科技股份有限公司,广东深圳518000

出　　处：《印制电路信息》2024年第10期39-42,共4页Printed Circuit Information

摘　　要：刚挠结合印制电路板(F⁃RPCB)中,非隔空结构多层软板(≥4层)由于软板之间存在特殊的黏结材料,组成成分复杂,压合后可靠性测试时,热冲击测试288℃/10 s/3次,或者回流焊测试时,挠性区域容易出现鼓泡、分层现象。介绍了一种多层软板叠构F⁃RPCB(2R+4F+2R),分析影响F⁃RPCB软板区域层压分层的关键结构因素和工艺方法,并通过机理分析、试验验证,制定出相应的设计方案,提高了多张软板非空腔叠构R-FPCB层压可靠性。Regarding rigid-flex printed circuit board(PCB)with multi-layer flex core(flex layers≥4)bonding together,without air gap structure,due to the complex composition of the flex region and the special bonding materials between the flex cores,during reliability testing after pressing with thermal shock at 288℃/10 s/3 times,or reflow soldering testing,the flex region is prone to bubbling and delamination.This article introduces a rigid-flex PCB with multi-layer flex core bonding together(2R+4F+2R),analyzes the key structural factors and process methods that affect the delamination of flex region,and formulates corresponding design rules by root cause analysis and experimental verification,improving the reliability of rigid-flex PCB with multi-layer flex core(flex layers≥4)bonding together.

关 键 词：刚挠结合印制电路板 非隔空结构 分层 热膨胀系数 

分 类 号：TN41[电子电信—微电子学与固体电子学]