改性双氰胺固化环氧树脂研究进展  

06Research progress on modified dicyandiamide cured epoxy resin

作　　者：杨雨鑫 娄春华[1,2] 于晶晶 王慧晓 Yang Yuxin;Lou Chunhua;Yu Jingjing;Wang Huixiao(College of Chemistry and Chemistry Engineering,Qiqihar University,Qiqihar 161006,Heilongjiang,China;Key Laboratory of Composite Materials,Heilongjiang Province,Qiqihar University,Qiqihar 161006,Heilongjiang,China)

机构地区：[1]齐齐哈尔大学化学与化学工程学院,黑龙江齐齐哈尔161006 [2]齐齐哈尔大学黑龙江省聚合物基复合材料重点实验室,黑龙江齐齐哈尔161006

出　　处：《中国胶粘剂》2024年第10期17-22,共6页China Adhesives

基　　金：黑龙江省省属高等学校基本科研业务费科研项目(135309437)。

摘　　要：双氰胺作为最早的潜伏性固化剂之一,其固化后的环氧树脂具有优异的机械性能,但仍然有固化温度过高等缺陷。针对这一缺陷,本文从降低双氰胺上氰基的吸电子能力进而增强固化活性以及引入相似基团增强双氰胺和环氧树脂的相容性两方面对国内外文献进行归纳总结,并对改性双氰胺固化后的环氧树脂的应用进行了展望。As one of the earliest latent curing agents,dicyandiamide has excellent mechanical properties in cured epoxy resin,but still has defects such as high curing temperature.In response to this deficiency,domestic and foreign literature from two aspects:reducing the electron withdrawing ability of the cyanide group on dicyandiamide to enhance curing activity,and introducing similar functional groups to enhance the compatibility between dicyandiamide and epoxy resin,was summarized in this article.The application prospects of modified dicyandiamide cured epoxy resin were also discussed.

关 键 词：双氰胺 环氧树脂 固化活性 相容性 氰基 

分 类 号：TQ430.4[化学工程]