基于双分支Cauer模型的IGBT模块键合线故障监测方法  

IGBT module bonding line fault monitoring method based on dual branch Cauer model

作　　者：刘雪庭 杜明星[1] 孙谢鹏 胡经纬 LIU Xueting;DU Mingxing;SUN Xiepeng;HU Jingwei(School of Electrical Engineering and Automation,Tianjin University of Technology,Tianjin 300384,China)

机构地区：[1]天津理工大学电气工程与自动化学院,天津300384

出　　处：《天津理工大学学报》2024年第5期75-79,共5页Journal of Tianjin University of Technology

基　　金：天津市技术创新引导专项基金(20YDTPJC00510)。

摘　　要：绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)作为电力电子装置的核心器件,针对IGBT模块不断承受温度变化和功率循环后导致的键合线脱落,文中在传统Cauer模型的基础上,提出了芯片-铜端子热流支路的Cauer模型,构建了双分支结构的Cauer模型,研究了IGBT模块键合线故障下从芯片到底板的稳态热阻抗,通过有限元热仿真对键合线脱落不同根数进行模拟,对模块温度进行分析,利用光纤温度传感器测量裸露在IGBT模块外部的铜端子温度,其变化可作为诊断键合线故障的重要依据,对IGBT模块状态监测及使用寿命进行预测,实验结果验证了所提出的方法的正确性。Insulated gate bipolar transistor(IGBT),as the core device of power electronic device,aims at the bond wire falling off caused by the constant temperature change and power cycle of IGBT module.Based on the traditional Cauer model,this paper proposes the Cauer model of chip-copper terminal heat flow branch,constructs the Cauer model of double branch structure,studies the steady-state thermal impedance of the IGBT module from the chip to the baseplate under the bond wire fault,simulates the different number of bond wires falling off through the finite element thermal simulation.The measurement of the temperature of the copper terminal exposed outside the IGBT module by the optical fiber temperature sensor can be used as an important basis for diagnosing the fault of the bond wire.The state monitoring and service life of the IGBT module are predicted.The experimental results verify the correctness of the method proposed.

关 键 词：绝缘栅双极型晶体管 键合线断裂 温度特性 Cauer热网络模型 

分 类 号：TN322.8[电子电信—物理电子学]