基于侧链氢键作用的高耐热无色透明聚酰亚胺薄膜的制备与性能研究  

Preparation and properties of high-temperature resistant and colorless transparent polyimide films based on side chain hydrogen bonding interaction

作　　者：杨雨箫 李琇廷 许青松 董杰[1] 赵昕[1] 滕翠青[1] 张清华[1] YANG Yuxiao;LI Xiuting;XU Qingsong;DONG Jie;ZHAO Xin;TENG Cuiqing;ZHANG Qinghua(Stata Key Laboratory for Modification of Chemical Fibers and Polymer Materials,Donghua University,Shanghai 201620,China)

机构地区：[1]东华大学纤维材料改性国家重点实验室,上海201620

出　　处：《绝缘材料》2024年第10期16-25,共10页Insulating Materials

基　　金：国家重点研发计划项目(2022YFB3603102);国家自然科学基金资助项目(U21A2087、52203033)。

摘　　要：随着柔性显示器件的不断更新,无色透明聚酰亚胺(CPI)薄膜作为衬底材料的研究备受关注。为解决CPI在光学性能、耐热性能、尺寸稳定性和力学性能之间的矛盾问题,本研究以环丁烷四酸二酐(CBDA)为二酐单体,2,2′-双(三氟甲基)-4-二氨基联苯(TFMB)和2-(3,5-二氨基苯基)-苯并咪唑(BBIA)为二胺单体,通过共聚制备了一系列侧链含苯并咪唑的半芳香CPI薄膜。结合Materials Studio软件模拟和实验测试结果,系统研究氢键、自由体积、主链结构对薄膜性能的影响规律。结果表明:所制备的CPI薄膜具有优良的光学透明性、耐热性能和力学性能,在380~780 nm波长范围的平均透过率高于85%,玻璃化转变温度超过400℃,线性热膨胀系数(CTE)为15×10^(-6)~17×10^(-6)K^(-1),最大拉伸强度达165 MPa,模量为3.7~5.2 GPa。With the constant updating of flexible display devices,the researches on colorless transparent polyimide(CPI)films as substrate materials have attracted considerable attention.In order to solve the inherent contradictions among optical performance,high-temperature resistance,dimensional stability,and mechanical properties of CPI,we synthesized a series of semi-aromatic CIP films with side chains containing benzimidazole by copolymerization using cyclobutanetetracarboxylic dianhydride(CBDA)as the dianhydride monomer,2,2′-bis(trifluoromethyl)-4-diaminobiphenyl(TFMB)and 2-(3,5-diaminophenyl)-benzimidazole(BBIA)as diamine monomers.The influence of hydrogen bonding,free volume,and main chain structure on the properties of films was systematically investigated by the Materials Studio software simulation and experimental results.The results show that the prepared CPI films have excellent optical transparency,thermal resistance,and mechanical properties.The average transmittance of CPI films in wave length of 380−780 nm is higher than 85%,the glass transition temperature(Tg)is above 400℃,the linear coefficient of thermal expansion(CTE)is 15×10^(-6)−17×10^(-6)K^(-1),the maximum tensile strength is 165 MPa,and the modulus is in the range of 3.7−5.2 GPa.

关 键 词：无色透明聚酰亚胺 柔性显示 氢键交联 耐热性能 光学性能 尺寸稳定性 力学性能 软件模拟 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业] TM215[一般工业技术—材料科学与工程]