电沉积黄铜薄膜开裂行为分析  

Analysis on cracking behavior of electrodeposited brass film

作　　者：樊沁娜 关沂山 李荣辉 FAN Qinna;GUAN Yishan;LI Ronghui(Shijiazhuang Tiedao University,Shijiazhuang 050043,China;China Petroleum Pipeline Engineering Co.,Ltd.,Langfang 065000,China;Hebei GEO University,Shijiazhuang 050031,China)

机构地区：[1]石家庄铁道大学,河北石家庄050043 [2]中石油管道局,河北廊坊065000 [3]河北地质大学,河北石家庄050031

出　　处：《电镀与涂饰》2024年第10期23-30,共8页Electroplating & Finishing

基　　金：河北地质大学博士科研启动金项目(BQ2024054);河北省高等教育规划研究课题(GJXH2024-103)。

摘　　要：[目的]对于在多晶基体上按三维岛状生长的薄膜,其生长应力在厚度方向上存在梯度,这种应力梯度显著影响着薄膜中裂纹的萌生和扩展。[方法]通过观察电沉积黄铜薄膜过程裂纹形态的演变,并原位测量生长应力,建立了薄膜应力梯度与开裂行为之间的联系。[结果]黄铜薄膜电沉积过程中的生长应力显著影响着其裂纹形态。在薄膜生长初期,压应力的存在能够抑制开裂。由岛状结构接触引起的张应力则会促使裂纹在薄膜表面萌生,这些裂纹更易出现在相邻岛状结构的边界处。随着沉积时间的延长,不断增大的生长张应力使薄膜表面裂纹逐渐向内部扩展。后期的压应力则促使裂纹形态从“V”形转变为“O”形。[结论]本文的研究结果可为制备新型低开裂敏感型薄膜提供理论依据。[Introduction]Thin films grown on polycrystalline substrates in the form of three-dimensional island have a gradient in growth stress along the thickness direction,which significantly affects the initiation and propagation of cracks within the films.[Method]The relationship between the stress gradient and cracking behavior of brass film was established by observing the evolution of crack morphology during the electrodeposition of brass film and conducting the in-situ measurement of growth stress.[Result]The crack pattern of brass film was greatly affected by its growth stress during electrodeposition.The presence of compressive stress could inhibit the cracking of the film at initial growth stage.While the tensile stress caused by the contact of island-like structures promoted the formation of cracks on film surface,which was more likely to occur at the boundaries of adjacent island-like structures.With the extending of electrodeposition time,cracks on film surface gradually propagated inwards due to the increasing of growth stress.The compressive stress at later stage induced a change in the crack pattern from V-shape to O-shape.[Conclusion]The findings of this study can provide a theoretical basis for the fabrication of new types of films with low cracking sensitivity.

关 键 词：电沉积 黄铜薄膜 开裂 生长应力 原位测量 

分 类 号：TQ153.14[化学工程—电化学工业]