附载体极薄铜箔中新型无机/有机复合剥离层的研究  

Study on a novel inorganic/organic composite peeling layer of carrier-attached ultrathin copper foil

作　　者：张少强 卢伟伟[1,2] 宋克兴 刘海涛[2,3] 武玉英 杨祥魁 樊斌锋 王庆福 ZHANG Shaoqiang;LU Weiwei;SONG Kexing;LIU Haitao;WU Yuying;YANG Xiangkui;FAN Binfeng;WANG Qingfu(College of Chemistry and Chemical Engineering,Henan University of Science and Technology,Luoyang 471023,China;Henan Key Laboratory of Nonferrous Metal Materials Science and Processing Technology,Luoyang 471023,China;School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China;School of Materials Science and Engineering,Shandong University,Ji’nan 250061 China;Shandong Jinbao Electronics Co.,Ltd.,Zhaoyuan 265400,China;Henan High Precision Copper Foil Industry Technology Research Institute Co.,Ltd.,Lingbao 472500,China)

机构地区：[1]河南科技大学化学化工学院,河南洛阳471023 [2]河南省有色金属材料科学与加工技术重点实验室,河南洛阳471023 [3]河南科技大学材料科学与工程学院,河南洛阳471023 [4]山东大学材料科学与工程学院,山东济南250061 [5]山东金宝电子有限公司,山东招远265400 [6]河南高精铜箔产业技术研究院有限公司,河南灵宝472500

出　　处：《电镀与涂饰》2024年第10期49-55,共7页Electroplating & Finishing

基　　金：国家重点研发计划项目(2021YFB3400800);河南省科技研发计划联合基金重点项目(225200810026);河南省重点研发专项(231111241000);河南省中原学者工作站资助项目(224400510025)。

摘　　要：[目的]剥离层是成功制备和应用附载体极薄铜箔的关键所在。针对目前单一无机或有机剥离层存在的问题,开展了无机-有机复合剥离层的研究,以期实现载体箔/剥离层/极薄铜箔的多界面剥离强度的差异化控制。[方法]首先电沉积制备了35μm厚的铜箔为载体箔,然后依次电沉积Zn-Ni合金层和浸镀2-巯基苯并咪唑(2-MBI)有机层,构建了无机/有机复合剥离层,最后在复合剥离层上电沉积极薄铜箔,制备出附载体极薄铜箔。[结果]Zn-Ni合金层浸镀于2-MBI中时,2-MBI分子可通过其N原子和S原子与Zn、Ni发生键合而锚定在合金层表面,进而构成Zn-Ni合金/2-MBI复合剥离层,令载体箔与极薄铜箔之间的剥离强度适中(约0.083N/mm),且两者剥离后极薄铜箔的光面无Zn-Ni合金残留。[结论]采用无机/有机复合剥离层可实现载体箔/剥离层/极薄铜箔多界面剥离强度的差异化控制,为成功制备附载体极薄铜箔奠定了基础。[Introduction]The peeling layer is crucial for the successful fabrication and application of carrier-attached ultrathin copper foil.However,both single organic and inorganic peeling layers have their shortcomings.It is necessary to develop an inorganic-organic composite peeling layer to achieve the differential control of peel strength at multiple interfaces of carrier foil,peeling layer,and ultrathin copper foil.[Method]Firstly,a 35μm-thick copper foil was prepared by electrodeposition as carrier.Secondly,an inorganic-organic composite peeling layer was fabricated by electrodeposition of Zn-Ni alloy layer and immersion in 2-mercaptobenzimidazole(2-MBI)successively.Finally,a carrier-attached ultrathin copper foil was obtained by electrodepositing an ultrathin copper foil onto the composite peeling layer.[Result]2-MBI molecules could be anchored onto the surface of Zn-Ni alloy layer through the bonding between N and S atoms with Zn and Ni,forming a Zn-Ni alloy/2-MBI composite peeling layer.The peel strength between the carrier foil and the ultrathin copper foil was moderate(about 0.083 N/mm)due to the presence of the composite peeling layer,and no Zn-Ni alloy layer would be left on the shiny side of the ultrathin copper foil after peeling.[Conclusion]The novel inorganic/organic composite peeling layer enables the differential control over the peel strengths of different interfaces in the carrier foil/peeling layer/ultrathin copper foil sandwich structure,laying the foundation for the successful fabrication of carrier-attached ultrathin copper foil.

关 键 词：附载体极薄铜箔 锌-镍合金 2-巯基苯并咪唑 复合剥离层 剥离强度 

分 类 号：TQ153.14[化学工程—电化学工业]