金刚石/铝复合材料的制备及其扩热可靠性研究  

Preparation and reliability test of diamond/aluminum composites

作　　者：王翔宇 李海珠 范德松[1] WANG Xiangyu;LI Haizhu;FAN Desong(MIIT Key Laboratory of Thermal Control of Electronic Equipment,School of Energy and Power Engineering,Nanjing University of Science&Technology,Nanjing 210094,China)

机构地区：[1]南京理工大学能源与动力工程学院,电子设备热控制工信部重点实验室,南京210094

出　　处：《功能材料》2024年第10期10008-10012,10029,共6页Journal of Functional Materials

基　　金：国家自然科学基金项目(52276069,51876091)。

摘　　要：金刚石/铝复合材料具有高导热和低密度等优点,是理想的航天电子器件散热材料。然而,目前对影响金刚石/铝复合材料热导率的影响因素和可靠性研究仍有不足。采用放电等离子烧结法,综合考虑了烧结温度、保温时间和金刚石粒径组合的影响,制备了热导率为462 W/(m·K)的金刚石/铝复合材料。同时,验证了复合材料在高低温和振动环境中的扩热可靠性。结果表明,当热流密度为70 W/cm^(2)时,与铝合金扩热板相比,金刚石/铝复合材料将带动热源温度下降13℃,在高低温和振动环境中仍具有热物理性质稳定性和结构可靠性,有效提升了电子设备的总体散热能力,为航空航天电子器件的发展提供了一种稳定、可靠的散热方案。Diamond/aluminum composites have the advantages of high thermal conductivity and low density,making them ideal cooling materials for aerospace electronic devices.However,there is a lack of comprehensive research on the factors influencing the thermal conductivity of diamond/aluminum composites,as well as their reliability.In view of the above problems,spark plasma sintering method was utilized to prepare diamond/aluminum composites with a thermal conductivity of 462 W/(m·K).It considered the effects of sintering temperature,holding time,and diamond particle size combination.Additionally,the heat spreader reliability of this diamond/aluminum composite in high and low temperature and vibration environment was studied.The results demonstrated that the diamond/aluminum composite effectively reduced the heat source temperature by 13℃compared to aluminum alloy when subjected to a heat flux of 70 W/cm^(2).Furthermore,diamond/aluminum composites can maintain stable physical properties and structural reliability in the high and low temperature and vibration environment,effectively exerting their heat dissipation capacity.Overall,diamond/aluminum composites can be presented as a reliable solution for heat dissipation in aerospace electronic devices.

关 键 词：金刚石/铝复合材料 热导率 电子器件散热 高低温 振动 

分 类 号：TB333[一般工业技术—材料科学与工程]