第三代半导体CIM系统集成设计与应用  

Integrated Design and Application of Third Generation Semiconductor CIM System

作　　者：张炜 赵辉良 罗超 何永平 肖骏 谢政廷 曾参 ZHANG Wei;ZHAO Hui-liang;LUO Chao;HE Yong-ping;XIAO Jun;XIE Zheng-ting;ZENG Can(The 48th Research Institute of China Electronics Technology Corporation)

机构地区：[1]中国电子科技集团公司第四十八研究所

出　　处：《中国集成电路》2024年第10期87-91,共5页China lntegrated Circuit

基　　金：湖南省科技计划项目经费资助2023PT1003。

摘　　要：在半导体制造企业推进数字化转型,建设CIM系统的过程中,各个数字化业务系统之间、数字化系统与车间设备之间打破数据孤岛,实现数据互联、互通、集成是所有企业面临的共同挑战。本文介绍第三代半导体CIM系统及各子系统的功能分工,重点对三个核心子系统MES、SPC、EAP之间以及EAP与设备监控系统之间的集成方案进行了介绍。该方案在某公司晶圆制造车间实现成功应用,可为半导体制造工厂CIM系统规划、设计开发、实施应用等提供参考。In the process of promoting digital transformation and building CIM systems in semiconductor manufactur-ing enterprises,breaking down data silos between various digital business systems and between digital systems and workshop equipment,and achieving data interconnection,interoperability,and integration is a common challenge faced by all enterprises.This article introduces the third-generation semiconductor CIM system and the functional division of each subsystem,with a focus on the integration solutions between the three core subsystems MES,SPC,EAP,and between EAP and equipment monitoring systems.This solution has been successfully applied in a wafer manufacturing workshop of a certain company,providing reference for CIM system planning,design and development,implementation and application in semiconductor manufacturing factories.

关 键 词：CIM系统 MES系统 SPC系统 EAP系统 系统集成 系统应用 

分 类 号：TN405[电子电信—微电子学与固体电子学]