等离子体改性聚酰亚胺热老化的分子模拟  

Molecular simulation of thermal aging of plasma-modified polyimide

作　　者：丁璨 田浩博 陈琛 DING Can;TIAN Hao-Bo;CHEN Chen(College of Electrical Engineering&New Energy,China Three Gorges University,Yichang 443002,China)

机构地区：[1]三峡大学电气与新能源学院,宜昌443002

出　　处：《原子与分子物理学报》2025年第1期95-100,共6页Journal of Atomic and Molecular Physics

摘　　要：通过反应分子动力学方法模拟聚酰亚胺的热老化过程,以模拟仿真等离子体改性后的聚酰亚胺材料在热裂解后的性能变化情况.通过研究老化过程中气体产生的情况,研究发现随着温度升高,分子链之间的相互作用力减弱,导致材料的致密性下降,弹性模量降低,材料抵抗外应力的能力减弱.同时,由于温度升高使得聚酰亚胺材料相对介电常数上升,材料绝缘性能下降,击穿强度也被削弱.The thermal aging process of polyimide is simulated by reactive molecular dynamics method to simulate the property changes of plasma-modified polyimide materials after thermal cracking.By studying the generation of gas during aging,it was found that as the temperature increases,the interaction forces between molecular chains weaken,resulting in a decrease in the denseness of the material,a decrease in the modulus of elasticity,and a decrease in the ability of the material to resist external stress.At the same time,due to the increase of temperature,the relative dielectric constant of the polyimide material increases,the insulation property of the material decreases and the breakdown strength is also weakened.

关 键 词：反应分子动力学 聚酰亚胺 热老化 

分 类 号：O522[理学—高压高温物理]