基于单颗磨粒磨削的SiCp/Al材料去除机理研究  

Research on the Material Removal Mechanism of SiCp/Al Based on Single Grain Grinding

作　　者：范磊 王娜[1] 尹国强[2] FAN Lei;WANG Na;YIN Guoqiang(School of Mechanical Engineering,Shenyang Urban Construction University,Shenyang 110167,China;School of Mechanical Engineering and Automation,Northeastern University,Shenyang 110819,China)

机构地区：[1]沈阳城市建设学院机械工程学院,沈阳110167 [2]东北大学机械工程与自动化学院,沈阳110819

出　　处：《组合机床与自动化加工技术》2024年第10期126-131,共6页Modular Machine Tool & Automatic Manufacturing Technique

基　　金：辽宁省教育厅基本科研项目(JYTMS20231536)。

摘　　要：基于单颗磨粒磨削的仿真和实验,研究了SiCp/Al复合材料的去除机理,并对体积分数为20%和55%的SiCp/Al材料加工表面/亚表面质量进行对比研究。通过建立单磨粒磨削SiCp/Al材料的有限元仿真模型,对材料的去除过程进行仿真模拟,研究了不同磨削深度对表面/亚表面质量的影响;通过单磨粒磨削实验验证了仿真结果的准确性,并深入研究体积分数分别为20%和55%的SiCp/Al材料的表面形貌,分析了Al基体与SiC颗粒的去除方式,此外,还研讨了SiC颗粒的塑性去除条件。最后,通过对磨屑形貌的分析,进一步研究了材料的去除机理。Based on the simulation and experiment of single abrasive grinding,the removal mechanism of SiCp/Al composites was studied,and the surface/subsurface quality of SiCp/Al materials with volume fraction of 20%and 55%was compared.By establishing a finite element simulation model of single abrasive grinding SiCp/Al material,the material removal process is simulated,and the influence of different grinding depths on surface/subsurface quality is studied.The accuracy of the simulation results is verified by the single abrasive grinding experiment,and the surface morphology of SiCp/Al materials with volume fractions of 20%and 55%respectively is deeply studied,and the removal methods of Al matrix and SiC particles are analyzed.In addition,the plastic removal conditions of SiC particles are also discussed.Finally,the removal mechanism of the material was further studied by analyzing the morphology of the debris.

关 键 词：SICP/AL复合材料 单磨粒磨削 材料去除机理 有限元仿真 表面/亚表面质量 

分 类 号：TH16[机械工程—机械制造及自动化] TG58[金属学及工艺—金属切削加工及机床]