基于Smith模糊多级积分分离PID的加热盘温度控制  

Temperature control of electric hotplate based on Smith fuzzy multi-level integral separation PID

作　　者：张硕 张爱华 董世杰 范狄庆 方宇 ZHANG Shuo;ZHANG Aihua;DONG Shijie;FAN Diqing;FANG Yu(School of Mechanical and Automotive Engineering,Shanghai University of Engineering Science,Shanghai 201620,China)

机构地区：[1]上海工程技术大学机械与汽车工程学院,上海201620

出　　处：《西北工业大学学报》2024年第5期939-947,共9页Journal of Northwestern Polytechnical University

基　　金：上海市揭榜挂帅项目(YDZX20213100003013)资助。

摘　　要：为提高大尺寸晶圆的加工良率,研究采用金属氧化物导电涂层加热的碳化硅晶圆加热盘分区控制方法,提出基于Smith模糊多级积分分离PID的四分区温控系统,解决高精度要求下晶圆加热盘表面温度一致性问题。通过热效应仿真建立系统模型,分析各区域的热量分布,进而基于PLC控制器搭建加热盘温度控制系统,提出便于实际应用的Smith模糊多级积分分离PID算法提高控制精度,在MATLAB中结合系统模型与常规PID算法进行对比,最后基于所建立的加热盘温度控制系统进行实验验证。仿真结果与实验结果均表明,所提控制方法具有更高的控制精度,可以实现加热盘表面温度一致性稳定在0.05℃左右,平均温度稳态误差±0.05℃,控制效果良好。In order to improve the processing yield of large-size wafers,the partition control method of silicon carbide wafer heating plate heated by metal oxide conductive coating is studied,and a 4-partition temperature control system based on Smith fuzzy multilevel integral separation PID is proposed so as to solve the surface temperature consistency of the wafer heating plate under the requirement of high precision.Through the thermal effect simulation to establish the system model,the heat distribution in each region is analyzed.And then the heating plate temperature control system based on PLC controller is built,and Smith fuzzy multilevel integral separation PID algorithm to facilitate the practical application to improve the control accuracy is proposed,combined with the system model and the conventional PID algorithm in MATLAB for comparison.Finally the experimental verification is carried out based on the established heating plate temperature control system.Simulation and experimental results show that the present control method has a higher control accuracy,and can realize the consistency of the surface temperature of the heating plate stabilized at about 0.05℃,the average temperature steady-state error±0.05℃,and the control effect is good.

关 键 词：晶圆加热盘 温度一致性 Smith模糊PID 多级积分分离 温控系统 

分 类 号：TP273[自动化与计算机技术—检测技术与自动化装置]