对VFO封装与常规WB封装的频率特性仿真比对  

Simulation comparison of frequency characteristics between VFO packaging and conventional WB packaging

作　　者：程振 廖伟豪 陈发众 钟敏聪 伍永青 毛忠宇 CHENG Zhen;LIAO Weihao;CHEN Fazhong;ZHONG Mincong;WU Yongqing;MAO Zhongyu(Shenzhen Longsys Electronics Co.,Ltd.,Shenzhen 518057,Guangdong,China;Chengdu PZEDA Electronic Technology Co.,Ltd.,Chengdu 610095,Sichuan,China)

机构地区：[1]深圳市江波龙电子股份有限公司,广东深圳518057 [2]成都派兹互连电子技术有限公司,四川成都610095

出　　处：《印制电路信息》2024年第11期21-25,共5页Printed Circuit Information

摘　　要：现代电子产品尤其是高性能存储器和通信设备对高效信号传递和低能耗需求迫切,要求封装技术在高频高速条件下展现卓越性能。垂直引线扇出(VFO)封装技术采用垂直金线连接芯片与底板,构建紧密的垂直互联体系,显著缩短信号传输路径,减少信号插入损耗和反射损耗,提高信号传输速度与质量,适应高频应用。通过仿真对比,研究揭示了VFO封装在高频操作中的性能优势。研究为筛选合适封装技术提供了可靠数据支撑,并为提升传统线接合(WB)封装在高频场合下的表现奠定了理论基础。Modern electronic products,especially high-performance memory and communication devices,have urgent demands for efficient signal transmission and low power consumption,requiring packaging technology to exhibit excellent performance under high-frequency and high-speed conditions.Vertical wire fan-out(VFO)packaging technology uses vertical gold wires to connect the chip and the substrate,constructing a tight vertical interconnection system.This design significantly shortens the signal transmission path,reduces signal insertion loss and reflection loss,improves signal transmission speed and quality,and adapts well to high-frequency applications.Through comparative simulation,the study reveals the performance advantages of VFO packaging in high-frequency operations.The research provides reliable data support for selecting appropriate packaging technology and lays a theoretical foundation for improving the performance of traditional wire bonding packaging in high-frequency applications.

关 键 词：垂直引线扇出封装 常规线接合封装 高频性能 仿真分析 

分 类 号：TN41[电子电信—微电子学与固体电子学]