配合相对误差对挤压式微流道密封技术的影响规律  

Influence Law of Relative Error of Fit on Extrusion-Based Microfluidic Sealing Technology

作　　者：曲振毅 倪维尧 付赢毅 吴梦希 刘军山[1,2] Qu Zhenyi;Ni Weiyao;Fu Yingyi;Wu Mengxi;Liu Junshan(State Key Laboratory of High-Performance Precision Manufacturing,School of Mechanical Engineering,Dalian University of Technology,Dalian 116024,China;Key Laboratory for Micro/Nano Technology and System of Liaoning Province,School of Mechanical Engineering,Dalian University of Technology,Dalian 116024,China)

机构地区：[1]大连理工大学机械工程学院高性能精密制造全国重点实验室,辽宁大连116024 [2]大连理工大学机械工程学院辽宁省微纳米技术及系统重点实验室,辽宁大连116024

出　　处：《微纳电子技术》2024年第11期83-90,共8页Micronanoelectronic Technology

基　　金：国家重点研发计划青年科学家项目(2022YFB3204600);大连理工大学医工交叉联合基金(DUT23YG215);大连理工大学科技领军人才团队项目(DUT22LAB504)。

摘　　要：由于检测通量的不断提高,微流控芯片包含的检测腔室数量多、间距小、与之连通的流道结构尺寸在微米尺度,这对密封过程的操作精度提出了严苛的要求。探究了外部挤压刀具与微流道位置存在配合相对误差时微流道的塑性变形情况,分析了微流道密封失效的原因,总结了相邻检测腔室内反应液互串的发生规律。统计数据揭示了配合相对误差对密封效果的影响,发现芯片主体和支撑板在宽度方向的配合相对误差对密封成功与否起主导作用,而长度方向的配合相对误差对密封效果影响起次要作用。当宽度方向配合相对误差小于17.7%时,芯片密封成功率为100%;当宽度方向配合相对误差为17.7%~23.5%时,长度方向配合相对误差大于34.2%将导致密封的失效。基于以上结果,对芯片制作和密封过程进行优化,使得宽度方向配合相对误差主要集中在6.8%~8.1%,最大值不超过14.9%。制备并密封后的高通量微流控芯片经温度循环密封测试验证,密封效果优异,所有的检测腔室均未发生泄漏。揭示了影响挤压式微流道密封技术的主要因素,为阵列式微流控芯片的设计与制作提供了参考。Due to the increasing detection throughput,the microfluidic chip contains a large number of detection chambers with small spacing,making the structural dimensions of the flow channels connected to them within the micrometer scale,which puts stringent requirements on the operational accuracy of the sealing process.The plastic deformation of the microfluidic channel was investigated when there is a relative error of fit between the external extrusion tool and the position of the microfluidic channel,the reasons for the sealing failure of the microfluidic channel were analyzed,and the occurrence law of the reaction liquid inter-conjugation in the adjacent detection chambers was summarized.The influence of the relative error of fit on the sealing effect was revealed by the statistical data.It is found that the relative error of fit of the chip body and the support plate in the width direction plays a dominant role in the success of the sealing,while the relative error of fit in the length direction plays a secondary role in the sealing effect.The success rate of the chip sealing is 100%when the relative error of fit in the width direction is less than 17.7%.When the relative error of fit in the width direction is 17.7%-23.5%,a relative error of fit in the length direction is greater than 34.2%,which will lead to the failure of sealing.Based on the above results,the chip fabrication and sealing process were optimized,so that the relative error of fit in the width direction is mainly concentrated in the range of 6.8%-8.1%,and the maximum value does not exceed 14.9%.The prepared and sealed high-throughput microfluidic chip was verified by the temperature cycling sealing test.The sealing effect is excellent with no leakage for all the detection chambers.The main factors affecting the extrusion-based microfluidic sealing technology are revealed,which provides a reference for the design and fabrication of arrayed microfluidic chips.

关 键 词：微流控芯片 密封技术 配合偏差 超声焊接 独立密封 

分 类 号：TB42[一般工业技术]