手机显示屏热熔胶-基底粘接结构可靠性仿真分析  

Simulation and Analysis of Reliability of Mobile Phone Display Hot Melt Adhesive⁃Substrate Bonding Structure

作　　者：吴雨峰 李月婵 谢安 WU Yufeng;LI Yuechan;XIE An(Fujian Key Laboratory of Functional Materials and Applications,Xiamen 361024,China;School of Materials Science and Engineering,Xiamen University of Technology,Xiamen 361024,China)

机构地区：[1]福建省功能材料及应用重点实验室,福建厦门361024 [2]厦门理工学院材料科学与工程学院,福建厦门361024

出　　处：《厦门理工学院学报》2024年第5期60-69,共10页Journal of Xiamen University of Technology

基　　金：厦门市重大科技项目“消费电子用高端生物基聚氨酯热熔胶的研发及产业化应用”(3502Z20231017)。

摘　　要：为探究不同热熔胶-基底粘接结构的可靠性问题,采用Ansys Workbench仿真软件,分别模拟聚氨酯热熔胶、共聚酯热熔胶和聚碳酸酯热熔胶与以油墨玻璃、硅单质和金属铝为基底的粘接结构的可靠性,考察温度场与应力场作业下不同粘接结构的热学与力学性能。仿真对比结果显示,在载荷与边界条件等外部环境一定的极端环境下,聚碳酸酯-硅基底粘接结构具有最佳的散热性与抗冲击性,其可靠程度最高,为最佳的粘接结构。To better understand reliability of different hot melt adhesive substrate bonding structures,Ansys Workbench simulations were conducted on polyurethane hot melt adhesive,copolyester hot melt adhesive,polycarbonate hot melt adhesive mixed respectively with varied bonding structures based on inked glass,silicon element,and metal aluminum substrates respectively,and thermal and mechanical properties of different bonding structures under temperature and stress field operations investigated.Comparison of the simulation results show that under extreme conditions when load and boundary are constant,the polycarbonate silicon substrate bonding structure has the best heat dissipation and impact resistance,and therefore the highest reliability.

关 键 词：手机显示屏 热熔胶-基底粘接结构 可靠性 Ansys Workbench仿真 

分 类 号：O484.2[理学—固体物理] O411.3[理学—物理]